TC1264_06 Datasheet, PDF (11/18 Pages) Microchip Technology – 800 mA Fixed-Output CMOS LDO with Shutdown

TC1264
3-Lead Plastic Transistor Outline (AB) (TO-220)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
E
A
E/2
φP
A1
E1
Q
D
D1
H1
α
D2
5X
E3
D3
D4
L1
L
b2
PIN 1
PIN n
b
e
c
e1
BOTTOM: VARIANT A
A2
BOTTOM: VARIANT B
Units
INCHES*
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
MIN
NOM
MAX
Number of Pins
Pitch
n
3
e
.100 BSC
3
2.54 BSC
Overall Pin Pitch
e1
.200 BSC
5.08 BSC
Overall Height
A
.140
-
.190
3.56
-
4.83
Tab Thickness
A1
.020
-
.055
0.51
-
1.40
Base to Lead
A2
.080
-
.120
2.03
-
3.05
Overall Width
E
.380
-
.420
9.65
-
10.67
Exposed Tab Width
E1
.270
-
.350
6.86
-
8.89
– (SEE BOTTOM VARIANT B)
E3
.251
.256
.261
6.38
6.50
6.63
Hole Center to Tab Edge
Q
.100
-
.120
2.54
-
3.05
Overall Length
D
.560
-
.650
14.22
-
16.51
Molded Package Length
D1
.330
-
.361
8.38
-
9.17
Exposed Tab Length
D2
.480
-
.507
12.19
-
12.88
– (SEE BOTTOM VARIANT B)
D3
.243
.248
.253
6.17
6.30
6.43
– (SEE BOTTOM VARIANT B)
D4
.303
.308
.313
7.70
7.82
7.95
Tab Length
H1
.230
-
.270
5.84
-
6.86
Mounting Hole Diameter
φP
.139
-
.156
3.53
-
3.96
Lead Length
L
.500
-
.580
12.70
-
14.73
Lead Shoulder
L1
-
-
.250
2.10
-
6.35
Foot Angle
α
0
-
8°
0
-
8°
Lead Thickness
c
.012
-
.024
0.30
-
0.61
Lead Width
b
.015
.027
.040
0.38
0.69
1.02
Shoulder Width
b2
.045
.057
.070
1.14
1.45
1.78
*Controlling Parameter
Notes:
Dimensions D1 and E do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
Drawing No. C04-158
© 2006 Microchip Technology Inc.
DS21375C-page 11