24C01SC_04 Datasheet, PDF (9/16 Pages) Microchip Technology – 1K/2K 5.0V I2C Serial EEPROMs for Smart Cards

7.0 PAD DESCRIPTIONS
TABLE 7-1:
Name
VSS
SDA
SCL
VCC
DC
PAD FUNCTION TABLE
Function
Ground
Serial Address/Data I/O
Serial Clock
+4.5V to 5.5V Power Supply
Don’t connect
7.1 SDA Serial Address/Data Input/
Output
This is a bidirectional pad used to transfer addresses
and data into and data out of the device. It is an open
drain terminal, therefore the SDA bus requires a pull-up
resistor to VCC (typical 10K¾ for 100 kHz, 2 K¾ for
400 kHz).
For normal data transfer SDA is allowed to change only
during SCL low. Changes during SCL high are
reserved for indicating the Start and Stop conditions.
7.2 SCL Serial Clock
This input is used to synchronize the data transfer from
and to the device.
7.3 DC Don’t Connect
This pad is used for test purposes and should not be
bonded out. It is pulled down to VSS through an internal
resistor.
24C01SC/24C02SC
8.0 DIE CHARACTERISTICS
Figure 8-1 shows the die layout of the 24C01SC/02SC,
including bondpad positions. Table 8-1 shows the
actual coordinates of the bondpad midpoints with
respect to the center of the die.
FIGURE 8-1:
PDIP
VSS
DIE LAYOUT
VCC
SDA
DC
SCL
TABLE 8-1: BONDPAD COORDINATES
Pad Name
Pad Midpoint,
X dir.
Pad Midpoint,
Y dir.
VSS
SDA
SCL
VCC
Note 1:
2:
-495.000
749.130
-605.875
-271.875
479.875
-746.625
605.875
-261.375
Dimensions are in microns.
Center of die is at the 0,0 point.
 2004 Microchip Technology Inc.
DS21170E-page 9