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PL138-48 Datasheet, PDF (5/20 Pages) Microchip Technology – 2.5V to 3.3V, Low-Skew, 1:4 Differential PECL Fanout Buffer | |||
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PL138-48
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters
Sym. Min. Typ.
Max. Units
Conditions
Temperature Ranges
Ambient Operating Temperature
Junction Temperature
Storage Temperature Range
Soldering Temperature
TA
â40
â
TJ
â
â
TS
â65
â
â
â
â
+85
+110
+150
+260
°C Note 2
°C â
°C â
°C 10 sec.
Note 1:
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature, and the thermal resistance from junction to air (i.e., TA, TJ, ï±JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.
2: Operating temperature is guaranteed by design for all parts (commercial and industrial), but tested for
commercial grade only.
ï£ 2016 Microchip Technology Inc.
DS20005543B-page 5
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