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TCM1617 Datasheet, PDF (3/14 Pages) Microchip Technology – SMBus Thermal Sensor with External Diode Input
SMBus Thermal Sensor with External Diode Input
TCM1617
ELECTRICAL CHARACTERISTICS (CONT): VDD = 3.3V, –55°C ≤ TA ≤ 125°C, unless otherwise noted.
Symbol Parameter
Conditions
Min
Typ
Max
Unit
tCONV
Conversion Time
from CHIP STOP to Conv.
Complete (Note 2)
54
83
112
msec
∆CR
Conversion Rate Accuracy
See Conversion Rate Register Desc. –35
—
+35
%
2-Wire SMBus Interface
VIH
Logic Input High
2.2
—
—
V
VIL
Logic Input Low
—
—
0.8
V
VOL
SDA Output Low
IOL = 2 mA (Note 3)
IOL = 4 mA (Note 3)
—
—
0.4
V
—
—
0.6
V
CIN
Input Capacitance SDA, SCL
—
5
—
pF
ILEAK
I/O Leakage
–1
0.1
1
µA
SMBus PORT AC TIMING: VDD = 3.3V, –55 ≤ (TA = TJ) ≤ 125°C; CL = 80 pF, unless otherwise noted.
Symbol Parameter
Test Conditions
Min
Typ
Max
Unit
fSMB
tLOW
tHIGH
tR
tF
tSU(START)
tH(START)
tSU-DATA
tH-DATA
tSU(STOP)
tIDLE
SMBus Clock Frequency
Low Clock Period
High Clock Period
SMBus Rise Time
SMBus Fall Time
Start Condition Setup Time
(for Repeated Start Condition)
Start Condition Hold Time
Data in Set Up Time
Data in Hold Time
Stop Condition Setup Time
Bus Free Time Prior to
New Transition
10% to 10%
90% to 90%
10% to 90%
90% to 10%
90% SCL to 10% SDA
10
—
100
KHz
4.7
—
—
µsec
4
—
—
µsec
—
—
1,000
nsec
—
—
300
nsec
4
—
—
µsec
4
—
1000
—
1250
—
4
—
4.7
—
—
µsec
—
nsec
—
nsec
—
µsec
—
µsec
NOTES: 1. Operating current is an average value (including external diode injection pulse current) integrated over multiple conversion cycles.
Transient current may exceed this specification.
2. For true reccurring conversion time see Conversion Rate register description.
3. Output current should be minimized for best temperature accuracy. Power dissipation within the TCM1617 will cause self-heating and
temperature drift error.
4. Refer to Application Note 64.
 2001 Microchip Technology Inc. DS21485A
3
TCM1617-1 2/5/99