TC1017 Datasheet, PDF (3/22 Pages) Microchip Technology – 150 mA, Tiny CMOS LDO With Shutdown

TC1017
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise noted, V_IN = V_R + 1V, I_L = 100 µA, C_L = 1.0 µF, SHDN > V_IH, T_A = +25°C
Boldface type specifications apply for junction temperatures of – 40°C to +125°C.
Parameter
Sym
Min
Typ
Max
Units
Test Conditions
Settling Time
(from Shutdown Mode)
t_S
—
32
—
µs
Output Short-Circuit Current
I_OUTSC
—
120
—
mA
Thermal Regulation
Thermal Shutdown Die
Temperature
V_OUT/P_D
T_SD
—
0.04
—
V/W
—
160
—
°C
Thermal Shutdown Hysteresis
Output Noise
∆T_SD
eN
—
10
—
°C
—
800
—
nV/√Hz
SHDN Input High Threshold
V_IH
45
—
—
%V_IN
SHDN Input Low Threshold
V_IL
—
—
15
%V_IN
Note 1:
2:
3:
The minimum V_IN has to meet two conditions: V_IN ≥ 2.7V and V_IN ≥ (V_R + 2.5%) + V_DROPOUT.
V_R is the regulator voltage setting. For example: V_R = 1.8V, 2.7V, 2.8V, 3.0V.
TCVOUT
=
(_---V_{----O-----U-----T---M------A----X-----–-----}V_{----O----U-----T----M-----I---N----})_----×_{-----1--0----6-}
VOUT × ∆T
V_IN = 5V, I_L = 60 mA,
C_IN = 1 µF, C_OUT =
1 µF, f = 100 Hz
V_OUT = 0V, Average
Current
Notes 6, 7
f = 10 kHz
V_IN = 2.7V to 6.0V
V_IN = 2.7V to 6.0V
4: Regulation is measured at a constant junction temperature using low duty-cycle pulse testing. Load regulation is tested
over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating
effects are covered by the thermal regulation specification.
5: Dropout voltage is defined as the input-to-output differential at which the output voltage drops 2% below its nominal
value at a 1V differential.
6: Thermal regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied,
excluding load or line regulation effects. Specifications are for a current pulse equal to I_LMAX at V_IN = 6V for t = 10 msec.
7: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction-to-air (i.e. T_A, T_J, θ_JA). Exceeding the maximum allowable power
dissipation causes the device to initiate thermal shutdown. Please see Section 5.1, “Thermal Considerations”, for
more details.
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, V_DD = +2.7V to +5.5V and V_SS = GND.
Parameters
Sym Min Typ Max Units
Conditions
Temperature Ranges
Specified Temperature Range
T_A
-40
—
+85
°C Industrial Temperature parts
T_A
-40
— +125 °C Extended Temperature parts
Operating Temperature Range
T_A
-40
— +125 °C
Storage Temperature Range
T_A
-65
— +150 °C
Thermal Package Resistances
Thermal Resistance, 5L-SOT23
Thermal Resistance, 5L-SC-70
θ_JA
—
255
— °C/W
θ_JA
—
450
— °C/W
 2003 Microchip Technology Inc.
DS21813B-page 3