TC1017 Datasheet, PDF (14/22 Pages) Microchip Technology – 150 mA, Tiny CMOS LDO With Shutdown

TC1017
700
600
500
400
300
200
100
0
-40
-15
10
35
60
85
110
Ambient Temperature (°C)
FIGURE 5-3:
Power Dissipation vs.
Ambient Temperature (SOT-23 Package).
160
140
120
VIN - VOUT = 1V
100
80
60
40
20
0
-40
-15
10
35
60
85
110
Ambient Temperature (°C)
FIGURE 5-4:
Maximum Current vs.
Ambient Temperature (SOT-23 Package).
5.4 Layout Considerations
The primary path for heat conduction out of the SC-70
or SOT-23 package is through the package leads.
Using heavy wide traces at the pads of the device will
facilitate the removal of the heat within the package,
thus lowering the thermal resistance Rθ_JA. By lowering
the thermal resistance, the maximum internal power
dissipation capability of the package is increased.
V_IN
C₁
SHDN
U1
V_OUT
C₂
FIGURE 5-5:
Layout.
GND
SC-70 Package Suggested
DS21813B-page 14
 2003 Microchip Technology Inc.