PIC16F648A-I Datasheet, PDF (28/34 Pages) Microchip Technology – Push-Pull Output Sub-Microamp Comparators

MCP6541/1R/1U/2/3/4
14-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
E
E1
p
n
B
D
2
1
A
α
c
φ
β
L
A1
A2
Units
INCHES
MILLIMETERS*
Dimension Limits
MIN
NOM
MAX
MIN
NOM
MAX
Number of Pins
Pitch
n
14
p
.026 BSC
14
0.65 BSC
Overall Height
A
.039
.041
.043
1.00
1.05
1.10
Molded Package Thickness
A2
.033
.035
.037
0.85
0.90
0.95
Standoff
A1
.002
.004
.006
0.05
0.10
0.15
Overall Width
E
.246
.251
.256
6.25
6.38
6.50
Molded Package Width
E1
.169
.173
.177
4.30
4.40
4.50
Molded Package Length
D
.193
.197
.201
4.90
5.00
5.10
Foot Length
Foot Angle
L
.020
.024
.028
0.50
0.60
0.70
φ
0°
4°
8°
0°
4°
8°
Lead Thickness
c
.004
.006
.008
0.09
0.15
0.20
Lead Width
B
.007
.010
.012
0.19
0.25
0.30
Mold Draft Angle Top
α
12° REF
12° REF
Mold Draft Angle Bottom
β
12° REF
12° REF
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold fla sh or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
REF: Reference Dimension, usually without tole rance, for information purposes only.
See ASME Y14.5M
JEDEC Equivalent: MO-153 AB-1
Drawing No. C04-087
Revised: 08-17-05
DS21696E-page 28
© 2006 Microchip Technology Inc.