PIC16F648A-I Datasheet, PDF (27/34 Pages) Microchip Technology – Push-Pull Output Sub-Microamp Comparators

MCP6541/1R/1U/2/3/4
14-Lead Plastic Small Outline (SL) – Narrow, 150 mil (SOIC)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
E
E1
p
D
B
n
45°
c
2
1
h
A
α
A2
φ
A1
L
β
Units
INCHES*
MILLIMETERS
Dimension Limits MIN
NOM
MAX
MIN
NOM
MAX
Number of Pins
n
14
14
Pitch
p
.050
1.27
Overall Height
A
.053
.061
.069
1.35
1.55
1.75
Molded Package Thickness
A2
.052
.056
.061
1.32
1.42
1.55
Standoff
§
A1
.004
.007
.010
0.10
0.18
0.25
Overall Width
E
.228
.236
.244
5.79
5.99
6.20
Molded Package Width
E1
.150
.154
.157
3.81
3.90
3.99
Overall Length
D
.337
.342
.347
8.56
8.69
8.81
Chamfer Distance
h
.010
.015
.020
0.25
0.38
0.51
Foot Length
L
.016
.033
.050
0.41
0.84
1.27
Foot Angle
φ
0
4
8
0
4
8
Lead Thickness
c
.008
.009
.010
0.20
0.23
0.25
Lead Width
B
.014
.017
.020
0.36
0.42
0.51
Mold Draft Angle Top
α
0
12
15
0
12
15
Mold Draft Angle Bottom
β
0
12
15
0
12
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-065
Revised 7-20-06
© 2006 Microchip Technology Inc.
DS21696E-page 27