DM163006 Datasheet, PDF (269/320 Pages) Microchip Technology – High-Performance ROM-less Microcontrollers

PIC18C601/801
22.1 DC Characteristics (Continued)
PIC18LC601/801
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for industrial
PIC18C601/801
(Industrial, Extended)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for industrial
-40°C ≤ TA ≤ +125°C for extended
Param
No.
Symbol
Characteristic/
Device
Min Typ Max Units
Conditions
D020
IPD
Power-down Current⁽³⁾
PIC18LC601/801 — TBD 5
µA VDD = 2.5V, -40°C to +85°C
—
—
36 µA VDD = 5.5V, -40°C to +85°C
—
— TBD µA VDD = 2.5V, 25°C
D020
PIC18C601/801 —
—
TBD TBD
— 36
µA VDD = 4.2V, -40°C to +85°C
µA VDD = 5.5V, -40°C to +85°C
D020A
—
— TBD µA VDD = 4.2V, 25°C
D021B
— TBD TBD µA VDD = 4.2V, -40°C to +125°C
—
—
42
VDD = 5.5V, -40°C to +125°C
D022
∆IWDT
Module Differential Current
PIC18LC801/601 — TBD TBD µA VDD = 2.5V
Watchdog Timer — 6.5 12 µA VDD = 3.0V
—
— TBD µA VDD = 5.5V
—
— TBD µA VDD = 2.5V, 25°C
D022
PIC18C601/801 —
Watchdog Timer —
—
— TBD µA VDD = 5.5V, -40°C to +85°C
— TBD µA VDD = 5.5V, -40°C to +125°C
— TBD µA VDD = 4.2V, 25°C
D022B
∆ILVD
PIC18LC801/601 —
Low Voltage Detect —
—
50
µA VDD = 2.5V
— TBD µA VDD = 2.5V, 25°C
D022B
PIC18C601/801 —
Low Voltage Detect —
—
— TBD µA VDD = 4.2V, -40°C to +85°C
— TBD µA VDD = 4.2V, -40°C to +125°C
— TBD µA VDD = 4.2V, 25°C
D025
∆IOSCB
PIC18LC801/601 —
Timer1 Oscillator —
—
3
µA VDD = 2.5V
— TBD µA VDD = 2.5V, 25°C
D025
PIC18C601/801 —
Timer1 Oscillator —
—
— TBD µA VDD = 4.2V, -40°C to +85°C
— TBD µA VDD = 4.2V, -40°C to +125°C
— TBD µA VDD = 4.2V, 25°C
Legend: Rows with industrial-extended data are shaded for improved readability.
Note 1: This is the limit to which VDD can be lowered in SLEEP mode, or during a device RESET, without losing
RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin
loading and switching rate, oscillator type, internal code execution pattern and temperature, also have an
impact on the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail to rail; all I/O pins tri-stated, pulled to VDD
MCLR = VDD; WDT enabled/disabled as specified.
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is
measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD or VSS, and
all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, ...).
4: For RC osc option, current through REXT is not included. The current through the resistor can be estimated
by the formula Ir = VDD/2REXT (mA) with REXT in kOhm.
 2001 Microchip Technology Inc.
Advance Information
DS39541A-page 269