TC1313 Datasheet, PDF (21/28 Pages) Microchip Technology – 500 mA Synchronous Buck Regulator, + 300 mA LDO

TC1313
10-Lead Plastic Dual Flat No Lead Package (MF) 3x3x0.9 mm Body (DFN) – Saw Singulated
E
PIN 1
ID INDEX
AREA
(NOTE 2)
TOP VIEW
p
b
n
L
D
D2
EXPOSED
METAL
PAD
21
E2
BOTTOM VIEW
A
A3
EXPOSED
A1
TIE BAR
(NOTE 1)
Units
Dimension Limits
Number of Pins
n
Pitch
e
Overall Height
A
Standoff
A1
Lead Thickness
A3
Overall Length
E
Exposed Pad Length
E2
Overall Width
D
Exposed Pad Width
D2
Lead Width
b
Lead Length
L
INCHES
MIN
NOM
10
.020 BSC
.031
.035
.000
.001
.008 REF.
.112
.118
.082
.094
.112
.118
.051
.065
.008
.010
.012
.016
MAX
.039
.002
.124
.096
.124
.067
.015
.020
MILLIMETERS*
MIN
NOM
10
0.50 BSC
0.80
0.90
0.00
0.02
0.20 REF.
2.85
3.00
2.08
2.39
2.85
3.00
1.30
1.65
0.18
0.25
0.30
0.40
*Controlling Parameter
Notes:
1. BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
2. REF: Reference Dimension, usually without tolerance, for information purposes only.
See ASME Y14.5M
Exposed pad varies according to die attach paddle size.
Package may have one or more exposed tie bars at ends.
Pin 1 visual index feature may vary, but must be located within the hatched area.
JEDEC equivalent: Not Registered
Drawing No. C04-063, Revised 05-05-05
MAX
1.00
0.05
3.15
2.45
3.15
1.70
0.30
0.50
© 2005 Microchip Technology Inc.
DS21974A-page 21