PIC16F87_13 Datasheet, PDF (205/230 Pages) Microchip Technology – 18/20/28-Pin Enhanced Flash MCUs with nanoWatt Technology

20.0 PACKAGING INFORMATION
20.1 Package Marking Information
18-Lead PDIP (300 mil)
18-Lead SOIC (7.50 mm)
20-Lead SSOP (5.30 mm)
PIC16F87/88
Example
PIC16F88-I/P e3
0510017
Example
PIC16F88
-I/SO e3
0510017
Example
PIC16F88
-I/SS e3
0510017
28-Lead QFN (6x6 mm)
Example
PIN 1
XXXXXXXX
XXXXXXXX
YYWWNNN
PIN 1
PIC16F88
-I/SS e3
0510017
Legend:
XX...X
Y
YY
W_e3W
NNN
*
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
e3
This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
 2002-2013 Microchip Technology Inc.
DS30487D-page 205