MIC4600 Datasheet, PDF (20/26 Pages) Microchip Technology – 28V Half-Bridge MOSFET Driver

MIC4600
16-Lead VQFN 3 mm x 3 mm Package Outline and Recommended Land Pattern
16-Lead Plastic Quad Flat, No Lead Package (8N) - 3x3x1.0 mm Body [VQFN]
Wettable Flanks (Stepped), 0.35 mm Terminal Length
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
C1
X2
EV
C2 Y2 EV
ØV
G2
G1
Y1
X1
SILK SCREEN
E
RECOMMENDED LAND PATTERN
Units
Dimension Limits
Contact Pitch
E
Optional Center Pad Width
X2
Optional Center Pad Length
Y2
Contact Pad Spacing
C1
Contact Pad Spacing
C2
Contact Pad Width (X16)
X1
Contact Pad Length (X16)
Y1
Contact Pad to Center Pad (X16) G1
Contact Pad to Contact Pad (X12) G2
Thermal Via Diameter
V
Thermal Via Pitch
EV
MILLIMETERS
MIN
NOM
MAX
0.50 BSC
1.50
1.50
2.60
2.60
0.30
0.50
0.30
0.20
0.30
1.00
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
Microchip Technology Drawing C04-2404A
DS20005584A-page 20
 2016 Microchip Technology Inc.