24AA52_05 Datasheet, PDF (20/28 Pages) Microchip Technology – 2K 2.2V I2C™ Serial EEPROM with Software Write-Protect

24AA52/24LCS52
8-Lead Plastic Dual Flat No Lead Package (MC) 2x3x0.9 mm Body (DFN) – Saw Singulated
D
E
b
K
p
n
L
E2
PIN 1
ID INDEX
AREA
(NOTE 1)
TOP VIEW
EXPOSED
METAL
PAD
(NOTE 2)
DETAIL
ALTERNATE
CONTACT
CONFIGURATION
21
D2
BOTTOM VIEW
A1 ^A
EXPOSED
TIE BAR
A3
(NOTE 3)
Units
INCHES
Number of Pins
Pitch
Dimension Limits
n
e
MIN
NOM
MAX
8
.020 BSC
Overall Height
Standoff
A
.031
.035
.039
A1
.000
.001
.002
Contact Thickness
Overall Length
Overall Width
Exposed Pad Length
Exposed Pad Width
A3
.008 REF.
D
.079 BSC
E
.118 BSC
D2
.051
–
.069
E2
.059
–
.075
Contact Length §
L
Contact-to-Exposed Pad
§
K
.012
.008
.016
–
.020
–
Contact Width
b
.008
.010
.012
* Controlling Parameter
** Not within JEDEC parameters
§ Significant Characteristic
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Exposed pad may vary according to die attach paddle size.
3. Package may have one or more exposed tie bars at ends.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
REF: Reference Dimension, usually without tolerance, for information purposes only.
See ASME Y14.5M
JEDEC Equivalent MO-229 VCED-2
DWG No. C04-123
MILLIMETERS*
MIN
NOM
8
0.50 BSC
0.80
0.90
0.00
0.02
0.20 REF.
2.00 BSC
3.00 BSC
1.30**
–
1.50**
–
0.30
0.40
0.20
–
0.20
0.25
MAX
1.00
0.05
1.75
1.90
0.50
–
0.30
Revised 09-12-05
DS21166J-page 20
© 2005 Microchip Technology Inc.