MRF89XAM9A_12 Datasheet, PDF (17/36 Pages) Microchip Technology – 915 MHz Ultra Low-Power Sub-GHz Transceiver Module

3.0 REGULATORY APPROVAL
The MRF89XAM9A module has received regulatory
approvals for modular devices in the United States and
Canada. Modular device approval allows the end user
to place the MRF89XAM9A module inside a finished
product and it does not require regulatory testing for an
intentional radiator (RF transmitter), provided no
changes or modifications are made to the module
circuitry. Changes or modifications could void the
user’s authority to operate the equipment. The end
user must comply with all of the instructions provided
by the Grantee, which indicate installation and/or
operating conditions necessary for compliance.
The integrator is still responsible for testing the end
product for any additional compliance requirements
required with this module installed (digital device
emission, PC peripheral requirements, etc.) in the
specific country that the end device will be marketed.
For more information on regulatory compliance, refer to
the specific country radio regulations in the following
sections.
3.1 United States
The MRF89XAM9A has received Federal
Communications Commission (FCC) CFR47
Telecommunications, Part 15 Subpart C “Intentional
Radiators” 15.247 and 15.249 and modular approval in
accordance with Part 15.212 Modular Transmitter
approval. The MRF89XAM9A module can be
integrated into a finished product without obtaining
subsequent and separate FCC certification.
The MRF89XAM9A module has been labeled with its
own FCC ID number, and if the FCC ID is not visible
when the module is installed inside another device,
then the outside of the finished product into which the
module is installed must also display a label referring
to the enclosed module. This exterior label can use the
following wordings:
Contains Transmitter Module FCC ID:
OA3MRF89XAM9A
or
Contains FCC ID: OA3MRF89XAM9A
This device complies with Part 15 of the FCC Rules.
Operation is subject to the following two conditions:
(1) this device may not cause harmful interference,
and (2) this device must accept any interference
received, including interference that may cause
undesired operation.
MRF89XAM9A
Requirements for product labeling are given in Part
15.19 Labelling Requirements.
The user’s manual should include the following
statement:
This equipment has been tested and found to comply
with the limits for a Class B digital device, pursuant to
part 15 of the FCC Rules. These limits are designed to
provide reasonable protection against harmful
interference in a residential installation. This
equipment generates, uses and can radiate radio
frequency energy, and if not installed and used in
accordance with the instructions, may cause harmful
interference to radio communications. However, there
is no guarantee that interference will not occur in a
particular installation. If this equipment does cause
harmful interference to radio or television reception,
which can be determined by turning the equipment
OFF and ON, the user is encouraged to try to correct
the interference by one or more of the following
measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment
and receiver.
• Connect the equipment into an outlet on a
circuit different from that to which the receiver is
connected.
• Consult the dealer or an experienced radio/TV
technician for help.
3.1.1 MRF89XAM9A SETTINGS
To meet the FCC requirements, the following settings
must be observed by the integrator:
3.1.1.1 FSK Modulation
The following settings configure the MRF89XAM9A for
wideband digital modulation techniques that conform to
the requirements of Part 15.247. These settings allow
higher radio frequency (RF) output power and greater
link budget:
• Bit Rate Setting: 50 - 200 kbps
- Transmit Power Maximum Setting: 13 dBm
• Bit Rate Setting: 2 - 40 kbps
- Transmit Power Maximum Setting: 7 dBm
• Frequency Deviation Setting: 200 kHz
• Data Whitening: On
• Lower Frequency Setting: 902.800 MHz
• Upper Frequency Setting: 926.500 MHz
 2011-2012 Microchip Technology Inc.
Preliminary
DS75017B-page 17