MRF89XAM9A_12 Datasheet, PDF (12/36 Pages) Microchip Technology – 915 MHz Ultra Low-Power Sub-GHz Transceiver Module

MRF89XAM9A
2.2 Printed Circuit Board
The MRF89XAM9A module PCB is constructed with
high temperature FR4 material that is four layers and
0.032 inches thick. The layers are shown in Figure 2-3
through Figure 2-8. The PCB layer stack up is shown in
Figure 2-9
FIGURE 2-3:
TOP SILK SCREEN
FIGURE 2-5:
GROUND PLANE
FIGURE 2-4:
TOP COPPER
FIGURE 2-6:
POWER PLANE
DS75017B-page 12
Preliminary
 2011-2012 Microchip Technology Inc.