TC1014_07 Datasheet, PDF (13/22 Pages) Microchip Technology – 50 mA, 100 mA and 150 mA CMOS LDOs with Shutdown and Reference Bypass

TC1014/TC1015/TC1185
5.0 THERMAL CONSIDERATIONS
5.1 Thermal Shutdown
Integrated thermal protection circuitry shuts the
regulator off when die temperature exceeds 160°C.
The regulator remains off until the die temperature
drops to approximately 150°C.
5.2 Power Dissipation
The amount of power the regulator dissipates is
primarily a function of input and output voltage, and
output current. The following equation is used to
calculate worst-case actual power dissipation:
EQUATION 5-1:
P_D ≈ (V_INMAX – V_OUTMIN)I_LOADMAX
Where:
P_D = Worst-case actual power
dissipation
V_INMAX = Maximum voltage on V_IN
V_OUTMIN = Minimum regulator output voltage
I_LOADMAX = Maximum output (load) current
The maximum allowable power dissipation
(Equation 5-2) is a function of the maximum ambient
temperature (T_AMAX), the maximum allowable die
temperature (T_JMAX) and the thermal resistance from
junction-to-air (θ_JA). The 5-pin SOT-23 package has a
θ_JA of approximately 220°C/Watt.
EQUATION 5-2:
P_DMAX
=
(_---T_{---J---M----A---X-----–----}T_{----A---M----A---X----})
θ_JA
Where all terms are previously defined.
Equation 5-1 can be used in conjunction with
Equation 5-2 to ensure regulator thermal operation is
within limits. For example:
Given:
V_INMAX = 3.0V +10%
V_OUTMIN = 2.7V – 2.5%
I_LOADMAX = 40 mA
T_JMAX = 125°C
T_AMAX = 55°C
Find:
1. Actual power dissipation
2. Maximum allowable dissipation
Actual power dissipation:
P_D ≈ (V_INMAX – V_OUTMIN)I_LOADMAX
= [(3.0 x 1.1) – (2.7 x .975)]40 x 10^–3
= 26.7 mW
Maximum allowable power dissipation:
P_DMAX
=
(_---T_{---J---M----A---X-----–----}T_{----A---M----A---X----})
θ_JA
= ⁽---1---2---5----^–-----5---5---⁾-
220
= 318 mW
In this example, the TC1014 dissipates a maximum of
26.7 mW below the allowable limit of 318 mW. In a
similar manner, Equation 5-1 and Equation 5-2 can be
used to calculate maximum current and/or input
voltage limits.
5.3 Layout Considerations
The primary path of heat conduction out of the package
is via the package leads. Therefore, layouts having a
ground plane, wide traces at the pads, and wide power
supply bus lines combine to lower θ_JA and therefore
increase the maximum allowable power dissipation
limit.
© 2007 Microchip Technology Inc.
DS21335E-page 13