CNY1733SD Datasheet, PDF (13/15 Pages) Microchip Technology – CNY171/2/3/4 and CNY17F1/2/3/4 are also available in white package by specifying M suffix (eg. CNY17F2M)

Marking Information (Black package non ‘M’ suffix)
1
CNY17-1 ²
V XX YY K ⁶
3
4
5
Definitions
1 Fairchild logo
2 Device number
3
VDE mark (Note: Only appears on parts ordered with VDE
option – See order entry table)
4
Two digits year code, e.g., ‘03’; One digit year code for ‘M’
version, e.g. ‘5’
5 Two digit work week ranging from ‘01’ to ‘53’
6 Assembly package code
Reflow Profile (Black Package, No Suffix)
300
215°C, 10–30 s
250
225 C peak
200
150
100
Time above 183°C, 60–150 sec
50
Ramp up = 3C/sec
0
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5
Time (Minute)
• Peak reflow temperature: 225°C (package surface temperature)
• Time of temperature higher than 183°C for 60–150 seconds
• One time soldering reflow is recommended
13
CNY17X, CNY17FX, MOC810X Rev. 1.0.5
www.fairchildsemi.com