CNY1733SD Datasheet, PDF (11/15 Pages) Microchip Technology – CNY171/2/3/4 and CNY17F1/2/3/4 are also available in white package by specifying M suffix (eg. CNY17F2M)

White Package (-M Suffix)
Package Dimensions (Through Hole)
0.350 (8.89)
0.320 (8.13)
Pin 1 ID
0.260 (6.60)
0.240 (6.10)
Package Dimensions (Surface Mount)
0.350 (8.89)
0.320 (8.13)
Pin 1 ID
0.390 (9.90)
0.260 (6.60) ^{0.332 (8.43)}
0.240 (6.10)
0.070 (1.77)
0.040 (1.02)
0.200 (5.08)
0.115 (2.93)
0.014 (0.36)
0.010 (0.25)
0.100 (2.54)
0.015 (0.38)
0.020 (0.50)
0.016 (0.41)
0.100 (2.54)
0.320 (8.13)
15°
0.012 (0.30)
0.070 (1.77)
0.040 (1.02)
0.200 (5.08)
0.115 (2.93)
0.025 (0.63)
0.020 (0.51)
0.020 (0.50)
0.016 (0.41)
0.014 (0.36)
0.010 (0.25)
0.320 (8.13)
0.012 (0.30)
0.008 (0.20)
0.100 [2.54]
0.035 (0.88)
0.012 (0.30)
Package Dimensions (0.4” Lead Spacing)
0.350 (8.89)
0.320 (8.13)
PIN 1 ID
0.260 (6.60)
0.240 (6.10)
0.070 (1.77)
0.040 (1.02)
0.014 (0.36)
0.010 (0.25)
0.200 (5.08)
0.115 (2.93)
0.100 (2.54)
0.015 (0.38)
0.020 (0.50)
0.016 (0.41)
0.100 [2.54]
0.012 (0.30)
0.008 (0.21)
0.425 (10.80)
0.400 (10.16)
Recommended Pad Layout for
Surface Mount Leadform
(White Package Only)
0.070 (1.78)
0.060 (1.52)
0.425 (10.79)
0.100 (2.54)
0.305 (7.75)
0.030 (0.76)
NOTE
All dimensions are in inches (millimeters)
11
CNY17X, CNY17FX, MOC810X Rev. 1.0.5
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