TC1411NEOA713 Datasheet, PDF (12/18 Pages) Microchip Technology – 1A High-Speed MOSFET Drivers

TC1411/TC1411N
8-Lead Plastic Small Outline (OA) – Narrow, 150 mil (SOIC)
Note:
For the most current package drawings, please
see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E
E1
p
B
n
D
2
1
45°
c
β
h
A
φ
L
A1
α
A2
Units
INCHES*
MILLIMETERS
Dimension Limits MIN
NOM
MAX
MIN
NOM
MAX
Number of Pins
n
8
8
Pitch
p
.050
1.27
Overall Height
A
.053
.061
.069
1.35
1.55
1.75
Molded Package Thickness
A2
.052
.056
.061
1.32
1.42
1.55
Standoff
§
A1
.004
.007
.010
0.10
0.18
0.25
Overall Width
E
.228
.237
.244
5.79
6.02
6.20
Molded Package Width
E1
.146
.154
.157
3.71
3.91
3.99
Overall Length
D
.189
.193
.197
4.80
4.90
5.00
Chamfer Distance
h
.010
.015
.020
0.25
0.38
0.51
Foot Length
L
.019
.025
.030
0.48
0.62
0.76
Foot Angle
φ
0
4
8
0
4
8
Lead Thickness
c
.008
.009
.010
0.20
0.23
0.25
Lead Width
B
.013
.017
.020
0.33
0.42
0.51
Mold Draft Angle Top
α
0
12
15
0
12
15
Mold Draft Angle Bottom
β
0
12
15
0
12
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
DS21390D-page 12
© 2006 Microchip Technology Inc.