TC1411NEOA713 Datasheet, PDF (10/18 Pages) Microchip Technology – 1A High-Speed MOSFET Drivers

TC1411/TC1411N
8-Lead Plastic Micro Small Outline Package (UA) (MSOP)
Note:
For the most current package drawings, please
see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E
E1
p
B
n
c
D
2
1
φ
A
α
A2
F
β
L
A1
Units
INCHES
MILLIMETERS*
Dimension Limits
MIN
NOM
MAX
MIN
NOM
MAX
Number of Pins
Pitch
n
8
p
.026 BSC
8
0.65 BSC
Overall Height
A
-
-
.043
-
-
1.10
Molded Package Thickness
A2
.030
.033
.037
0.75
0.85
0.95
Standoff
A1
.000
-
.006
0.00
-
0.15
Overall Width
E
.193 BSC
4.90 BSC
Molded Package Width
E1
.118 BSC
3.00 BSC
Overall Length
D
.118 BSC
3.00 BSC
Foot Length
L
.016
.024
.031
0.40
0.60
0.80
Footprint (Reference)
Foot Angle
F
.037 REF
0.95 REF
φ
0°
-
8°
0°
-
8°
Lead Thickness
c
.003
.006
.009
0.08
-
0.23
Lead Width
B
.009
.012
.016
0.22
-
0.40
Mold Draft Angle Top
α
5°
-
15°
5°
-
15°
Mold Draft Angle Bottom
β
5°
-
15°
5°
-
15°
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
REF: Reference Dimension, usually without tolerance, for information purposes only.
See ASME Y14.5M
JEDEC Equivalent: MO-187
Drawing No. C04-111
Revised 07-21-05
DS21390D-page 10
© 2006 Microchip Technology Inc.