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TH8055 Datasheet, PDF (6/15 Pages) Micro Electronics – Single Wire CAN Transceiver
TH8055
Single Wire CAN Transceiver
Electrical Specification
All voltages are referenced to ground (GND).
Positive currents flow into the IC. The absolute
maximum ratings given in the table below are
limiting values that do not lead to a permanent
damage of the device but exceeding any of these
limits may do so. Long term exposure to limiting
values may affect the reliability of the device.
Reliable operation of the TH8055 is only specified
within the limits shown in ”Operating conditions”.
Operating Conditions
Parameter
Battery voltage
Operating ambient temperature
Junction temperature
Symbol
Min
Max
Unit
VBAT
5.0
18
V
TA
-40
125
°C
TJ
-40
150
°C
Absolute Maximum Ratings
Parameter
Supply voltage
Short-term supply voltage
Transient supply voltage
Transient supply voltage
Transient supply voltage
CANH voltage
Transient bus voltage
Transient bus voltage
Transient bus voltage
DC voltage on pin LOAD
DC voltage on pins TxD,MODE1,MODE0,RxD
ESD capability of CANH
ESD capability of any other pins
Maximum latch-up free current at any Pin
Maximum power dissipation
Thermal impedance
Storage temperature
Junction temperature
Symbol
Condition
VBAT
VBAT.LD
VBAT.TR1
VBAT.TR2
VBAT.TR3
VCANH
VCANHTR1
VCANHTR2
VCANHTR3
VLOAD
VDC
VESDBUS
VESD
ILATCH
Ptot
JA
TSTG
TJ
Load dump; t<500ms
Jump start; t<1 min
ISO 7637/1 pulse 1 [1]
ISO 7637/1 pulses 2 [1]
ISO 7637/1 pulses 3A, 3B
VBAT=0
ISO 7637/1 pulse 1 [2]
ISO 7637/1 pulses 2 [2]
ISO 7637/1 pulses 3A, 3B [2]
via RT > 2k
Human body model
Equivalent to discharge 100pF
with 1.5k
Human body model
Equivalent to discharge 100pF
with 1.5k
At TA = 125 °C
in free air
Min
-0.3
-50
-200
-20
-50
-200
-40
-0.3
-4000
Max Unit
18
V
40
V
27
V
100
V
200
V
40
V
V
100
V
200
V
40
V
7
V
4000
V
-2000
-500
-55
-40
2000
V
500
mA
197 [3] mW
152
K/W
150
°C
150
°C
[1] ISO 7637 test pulses are applied to VBAT via a reverse polarity diode and >1uF blocking capacitor .
[2] ISO 7637 test pulses are applied to CANH via a coupling capacitance of 1 nF.
[3] The application board shall be realized with a ground copper foil area > 25mm2 .
390108055
Rev. 1.1a
Page 6 of 15
Jan 2002