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MIC25400 Datasheet, PDF (16/27 Pages) Micrel Semiconductor – 2A Dual Output PWM Synchronous Buck Regulator IC
Micrel, Inc.
Proper snubber design requires the parasitic inductance
and capacitance be known. A method of determining
these values and calculating the damping resistor value
is outlined below.
1. Measure the ringing frequency at the switch node
which is determined by parasitic LP and CP. Define this
frequency as f1.
2. Add a capacitor CS (normally at least 3 times as big as
the COSS of the FET) from the switch node-to-ground and
measure the new ringing frequency. Define this new
(lower) frequency as f2. LP and CP can now be solved
using the values of f1, f2 and CS.
3. Add a resistor RS in series with CS to generate critical
damping.
Step 1: First measure the ringing frequency on the
switch node voltage when the high-side MOSFET turns
on. This ringing is characterized by the equation:
f1 =
1
2π LP ⋅ CP
Where:
CP and LP are the parasitic capacitance and inductance
Step 2: Add a capacitor, CS, in parallel with the
synchronous MOSFET, Q2. The capacitor value should
be approximately 3 times the COSS of Q2. Measure the
frequency of the switch node ringing, f2.
f2 =
2π
1
LP ⋅ (CS + CP )
Define f’ as:
f' = f1
f2
Combining the equations for f1, f2 and f’ to derive CP, the
parasitic capacitance
CP
=
CS
2 ⋅ (f ' )2
−1
LP is solved by re-arranging the equation for f1.
LP
=
(2π)2
1
⋅ CP
⋅ (f1)2
Step 3: Calculate the damping resistor.
Critical damping occurs at Q=1
Q= 1
LP = 1
RS CS + CP
MIC25400
Solving for RS
RS =
LP
CS + CP
Figure 11 shows the snubber in the circuit and the
damped switch node waveform.
The snubber capacitor, Cs, is charged and discharged
each switching cycle. The energy stored in Cs is
dissipated by the snubber resistor, Rs, two times per
switching period. This power is calculated in the
equation below.
Psnubber = fS ⋅ CS ⋅ VIN2
Where:
fS is the switching frequency for each phase
VIN is the DC input voltage
Low-side MOSFET Selection
An external N-channel logic level power MOSFET must
be used for the low-side switch. The MOSFET gate-to-
source drive voltage of the MIC25400 is regulated by an
internal 5V regulator. Logic level MOSFETs, whose
operation is specified at VGS = 4.5V must be used. Use
of MOSFETs with a lower specified VGS (such as 3.3V or
2.5V) are not recommended since the low threshold can
cause them to turn on when the high-side FET is turning
on. When operating the regulator below a 6V input,
connect VDD to VIN to prevent the VDD regulator from
dropping out.
Total gate charge is the charge required to turn the
MOSFET on and off under specified operating conditions
(VDS and VGS). The gate charge is supplied by the
regulator’s gate drive circuit. Gate charge is a source of
power dissipation in the regulator due to the high
switching frequencies. At low output load this power
dissipation is noticeable as a reduction in efficiency. The
average current required to drive the MOSFETs is:
IDD = QG ⋅ fS
Where:
QG is the gate charge for both of the external MOSFETs.
This information should be obtained from the
manufacturer’s data sheet.
Since current from the gate drive is supplied by the input
voltage, power dissipated in the MIC25400 due to gate
drive is:
PGATE_DRIVE = QG ⋅ fS ⋅ VIN
Parameters that are important to MOSFET selection are:
• Voltage rating
• On resistance
• Total Gate Charge
January 2011
16
M9999-020111-C