MLX90367EDC-ABS Datasheet, PDF (33/36 Pages) Melexis Microelectronic Systems – TriaxisÒ Position Sensor IC feat. SENT

20.4. TSSOP16 - Package Dimensions
MLX90367
Triaxis^® Position Sensor IC feat. SENT
0.65 ± 0.04
12^O REF
0.20 ± 0.04
DIA 1.0 REF
1.0 REF
1.0 REF
4.90
5.10*
4.30
4.50** ^{6.4 ± 0.2}
0.85
0.95
1.1 MAX
12^O REF
0.09
0.20
0.09 MIN
0.09 MIN
0^O
0.50
8^O
0.75
1.0 ± 0.2
0.05
0.19
0.15
0.30***
NOTES:
All dimensions are in millimeters (anlges in degrees).
* Dimension does not include mold flash , protrusions or gate burrs(shall not exceed 0.15 per side).
** Dimension does not include interleads flash or protrusion (shall not exceed 0.25 per side).
*** Dimension does not include dambar protrusion. Allowable dambar protrusion shall be 0.08 mm total in excess of the dimension at
maximum material condition. Dambar cannot be located on the lower radius of the foot.
REF: Reference dimensions as stated in packaging supplier POD , based on JEDEC.
MLX90367
Rev 5.2
Page 33 of 36
Datasheet
Dec. 15, 15