MLX90366 Datasheet, PDF (27/34 Pages) Melexis Microelectronic Systems – Triaxis Position Sensor Assembly feat. SENT

MLX90366
Triaxis^ Position Sensor Assembly feat. SENT
16. Built-in Capacitors
VDD
VSS
OUT
C1
C2
C4
C3
C1 = C2 = C3 = C4 = 100 nF
Either Vss pin can be used for grounding, but always leave 1 floating.
Built-in capacitors are ceramic multilayer type X8R. The capacitors are specifically suited for high
temperature applications with stable capacitance value (± 15%) up to 150 DegC.
The capacitors are assembled using a gluing method instead of soldering to be more reliable towards
thermal/mechanical stress. The maximum rated voltage is 25V. C1=C2=C4 = 100nF and C3 = 10nF.
17. Standard information regarding manufacturability of Melexis
products with different lead pre-forming and soldering/welding
processes
For Dual Mold Package, please refer to the following document (available upon request):
Application Note Hall Sensors in Dual Mold Packages – (Doc#: 390110000001)
For more information on the lead free topic please see quality page at our website:
http://www.melexis.com/quality.aspx
18. ESD Precautions
Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).
Always observe Electro Static Discharge control procedures whenever handling semiconductor products.
MLX90366
Rev. 1.0
Page 27 of 34
Datasheet
25/Jun/13