MAX14886 Datasheet, PDF (9/10 Pages) Maxim Integrated Products – Dual DisplayPort Graphics Multiplexer with HDMI Level Shifter

Dual DisplayPort Graphics Multiplexer
with HDMI Level Shifter
Exposed-Pad Package
The exposed-pad, 40-pin TQFN package incorporates
features that provide a very low thermal resistance
path for heat removal from the IC. The exposed pad
on the device must be soldered to the circuit board
ground plane for proper electrical and thermal perfor-
mance. For more informat­ion on exposed-pad pack-
ages, refer to Application Note 862: HFAN-08.1: Thermal
Considerations of QFN and Other Exposed-Paddle
Packages.
PROCESS: BiCMOS
Chip Information
Package Information
For the latest package outline information and land patterns
(footprints), go to www.maxim-ic.com/packages. Note that a
“+”, “#”, or “-” in the package code indicates RoHS status only.
Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
PACKAGE
TYPE
40 TQFN-EP
PACKAGE
CODE
T4055+2
OUTLINE
NO.
21-0140
LAND
PATTERN NO.
90-0002
9