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MAX16928_12 Datasheet, PDF (2/20 Pages) Maxim Integrated Products – Automotive TFT-LCD Power Supply with Boost Converter and Gate Voltage Regulators
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MAX16928
Automotive TFT-LCD Power Supply with Boost
Converter and Gate Voltage Regulators
ABSOLUTE MAXIMUM RATINGS
INA, COMPV, FBP to GND......................................-0.3V to +6V
PGOOD to GND.......................................................-0.3V to +6V
CP, GH to GND......................................................-0.3V to +31V
CP, GH to GND (VINA = 3.3V)...............................-0.3V to +29V
LXP to GND............................................................-0.3V to +20V
DRVN to GND........................................................-25V to +0.3V
ENP, DR, FB, GATE, COMPI, FBGH,
FBGL, REF, SEQ to GND......................-0.3V to (VINA + 0.3V)
GND to PGNDP.....................................................-0.3V to +0.3V
Continuous Power Dissipation (TA = +70NC)
TSSOP (derate 26.5mW/NC above +70NC)................2122mW
Operating Temperature Range......................... -40NC to +105NC
Junction Temperature Range........................... -40NC to +150NC
Storage Temperature Range............................ -65NC to +150NC
Lead Temperature (soldering, 10s).................................+300NC
Soldering Temperature (reflow).......................................+260NC
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TSSOP
Junction-to-Ambient Thermal Resistance (BJA)........37.7NC/W
Junction-to-Case Thermal Resistance (BJC)..................2NC/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
ELECTRICAL CHARACTERISTICS
(VINA = 5V, VGND = VPGNDP = 0V, TA = TJ = -40NC to +105NC, typical values are at TA = +25NC unless otherwise noted.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
MIN TYP MAX UNITS
BOOST, POSITIVE (GH), NEGATIVE (GL), 1.8V/3.3V CONVERTERS
INA Input Supply Range
3
5.5
V
INA Undervoltage Lockout
Threshold
INA Supply Current
VINA rising, hysteresis = 200mV,
TA = +25NC
IINA
VFBP = VFBGH = 1.3V, VFBGL = 0V,
LXP not switching
2.5
2.7
2.9
V
1.5
2.0
mA
INA Shutdown Current
ISHDN
VENP = 0V, TA = +25NC
0.5
FA
Thermal Shutdown Temperature
TSHDN Temperature rising
+165
NC
Thermal Shutdown Hysteresis
TH
15
NC
Duration to Trigger Fault
Condition
VFBP, VFBGH, or VFBGL below its threshold
238
ms
Autoretry Time
1.9
s
REFERENCE (REF)
REF Output Voltage
REF Load Regulation
REF Undervoltage Lockout
Threshold
VREF
No output current
0 < IREF < 80FA, REF sourcing
Rising edge, hysteresis = 200mV
1.236 1.25 1.264
V
-2
+2
%
1.165
V
OSCILLATOR
Spread-Spectrum Factor
SSR
As a percentage of switching frequency,
fSW
Q4
%
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