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MAX16050 Datasheet, PDF (2/22 Pages) Maxim Integrated Products – Voltage Monitors/Sequencer Circuits with Reverse-Sequencing Capability
Voltage Monitors/Sequencer Circuits with
Reverse-Sequencing Capability
ABSOLUTE MAXIMUM RATINGS
(All voltages referenced to GND.)
VCC .........................................................................-0.3V to +30V
REM, OUT_, DISC_.................................................-0.3V to +30V
RESET, SHDN, SET_, FAULT, EN_HOLD, EN, DELAY,
OV_OUT, ABP, TIMEOUT, SEQ_...........................-0.3V to +6V
CP_OUT.........................................................-0.3V to (VCC + 6V)
RESET Current ....................................................................50mA
DISC_ Current ...................................................................180mA
Input/Output Current (all other pins) ...................................20mA
Continuous Power Dissipation (TA = +70°C)
28-Pin (4mm x 4mm) Thin QFN (derate 28.6mW/°C
above +70°C) ............................................................2285mW*
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature .....................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
*As per JEDEC51 Standard (Multilayer Board).
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VCC = 2.7V to 13.2V, VEN = VABP, TA = TJ = -40°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.) (Note 1)
PARAMETER
SYMBOL
CONDITIONS
MIN TYP MAX UNITS
Operating Voltage Range
(Note 2)
VCC
Voltage on VCC to ensure the device is fully
operational
2.7
13.2
V
Operating Voltage
Regulated Supply Voltage
VCCR
VDISC_ = VOUT_ = VRESET = low, voltage on
VCC rising
1.8
V
VABP
IABP = 1mA (external sourcing current from
ABP)
2.45
2.90
V
Undervoltage Lockout
VUVLO Minimum voltage on ABP, ABP rising
Undervoltage Lockout Hysteresis VUVLO_HYS ABP falling
Supply Current
MONITORED ANALOG INPUTS
ICC
VCC = 3.3V, all OUT_ = high, no load
SET_ Threshold
SET_ Threshold Hysteresis
VTH
SET_ falling
VTH_HYS SET_ rising
SET1–SET4 Input Current
SET5 Input Current
ISET
ISET5
VSET_ = 0.5V
VSET5 = 0.5V (MAX16051 only)
SET_ Threshold Tempco
Overvoltage Threshold
Overvoltage Threshold Hysteresis
ΔVTH/_TC
VTH_OV
SET_ falling
SET_ rising
EN Threshold
EN Threshold Hysteresis
VTH_EN EN_ falling
VEN_HYS EN_ rising
EN Input Current
IEN
VEN = 0.5V
SEQUENCING, CAPACITOR DISCHARGE, AND SEQUENCE TIMING OUTPUTS
OUT_ Output Low Voltage
VOL_OUT
VCC = 3.3V, ISINK = 3.2mA
VCC = 1.8V, ISINK = 100µA
OUT_ Leakage Current
ILKG_OUT VOUT_ = 12V, OUT_ asserted
DISC_ Output Pulldown Current
IOL_DISC
Pulldown current during fault condition or
power-down mode, VDISC_ = 1V
DISC_ Output Leakage Current
ILKG_DISC VDISC_ = 3.3V, not in power-down mode
DISC_ Power Low Threshold
VTH_PL DISC_ falling
2.1
2.3
V
100
mV
0.7
1.1
mA
0.492
-100
-30
0.541
0.492
-100
0.5
0.5
30
0.55
0.5
0.5
0.5
0.508
+100
+30
0.558
0.508
+100
V
%VTH
nA
µA
ppm/°C
V
%VTH_OV
V
%VTH_EN
nA
0.3
V
0.3
1
µA
85
mA
1
µA
200 250 300
mV
2 _______________________________________________________________________________________