MAX14852 Datasheet, PDF (2/22 Pages) Maxim Integrated Products – 2.75kVRMS Isolated 500kbps/25Mbps Full-Duplex

MAX14852/MAX14854
2.75kV_RMS Isolated 500kbps/25Mbps Full-Duplex
RS-485/RS-422 Transceivers
with ±35kV ESD Protection
Absolute Maximum Ratings
V_DDA to GNDA ........................................................-0.3V to +6V
V_DDB to GNDB.........................................................-0.3V to +6V
V_LDO to GNDB.......................................................-0.3V to +16V
TXD, DE, RE to GNDA ............................................-0.3V to +6V
SBA, RXD to GNDA .............................. -0.3V to (VDDA + 0.3V)
A, B, Z, Y to GNDB...................................................-8V to +13V
Short Circuit Duration (RXD, SBA to GNDA,
A, B, Y, Z ,V_DDB to GNDB).....................................Continuous
Continuous Power Dissipation (T_A = +70°C)
16-pin Wide SOIC
(derate 14.1mW/°C above +70°C)........................... 1126.8mW
Operating Temperature Range.......................... -40°C to +105°C
Junction Temperature.......................................................+150°C
Storage Temperature Range............................. -65°C to +150°C
Lead Temperature (soldering, 10s).................................. +300°C
Soldering Temperature (reflow)........................................ +260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics (Note 1)
Junction-to-Ambient Thermal Resistance (θ_JA)...............71°C/W
Junction-to-Case Thermal Resistance (θ_JC)....................23°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
DC Electrical Characteristics
(V_DDA – V_GNDA = 1.71V to 5.5V, V_DDB – V_GNDB = 3.0V to 5.5V, T_A = T_MIN to T_MAX, unless otherwise noted. Typical values are at
V_DDA – V_GNDA = 3.3V, V_DDB – V_GNDB = 3.3V, V_GNDA = V_GNDB, and TA = +25°C.) (Notes 2, 3)
PARAMETER
SYMBOL
CONDITIONS
MIN
POWER
Supply Voltage
V_DDA
V_DDB
1.71
3.0
Supply Current
I_DDA
I_DDB
VDDA = 5V, DE = high, RE = TXD = low,
RXD unconnected, no load
DE = high, RE = TXD = low, RXD uncon-
nected, no bus load, VDDB = 3.3V
Undervoltage Lockout Thresh- ^VUVLOA ^{VDDA rising}
1.50
old
V_UVLOB VDDB rising
2.55
Undervoltage Lockout Thresh- ^VUVHYSTA
old Hysteresis
V_UVHYSTB
LDO
TYP
3.9
7
1.58
2.7
50
200
MAX
5.5
5.5
6.6
12.5
1.65
2.85
UNITS
V
mA
V
mV
LDO Supply Voltage
LDO Supply Current
LDO Output Voltage
LDO Current Limit
VLDO Relative to GNDB, LDO is on (Note 4)
3.18
14
V
ILDO
DE = high, TXD = low, no bus load,
VLDO = 5.5V
7.5
12.9
mA
VDDB
3.0
3.3
3.6
V
300
mA
Load Regulation
Line Regulation
Dropout Voltage
VLDO = 3.3V, ILOAD = 20mA to 40mA
VLDO = 3.3V to 14V, ILOAD = 20mA
VLDO = 3.18V, IDDB = -120mA
0.19
1.7
mV/mA
0.12
1.8
mV/V
100
180
mV
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