MAX14808 Datasheet, PDF (2/31 Pages) Maxim Integrated Products – Octal Three-Level/Quad Five-Level High-Voltage 2A Digital Pulsers with T/R Switch

MAX14808 / MAX14809
Octal Three-Level/Quad Five-Level High-Voltage
2A Digital Pulsers with T/R Switch
ABSOLUTE MAXIMUM RATINGS
(All voltages referenced to GND.)
V_DD Logic Supply Voltage Range........................-0.3V to +5.6V
V_CC Positive Driver Supply Voltage Range..........-0.3V to +5.6V
V_EE Negative Driver Supply Voltage Range.........-5.6V to +0.3V
V_NNA, V_NNB High Negative
Supply Voltage Range......................................-110V to +0.3V
V_PPA, V_PPB High Positive
Supply Voltage Range......................................-0.3V to +110V
OUT_ Output Voltage Range..................................V_{NN_} to V_{PP_}
LVOUT_ Output Voltage Range
(100mA Maximum Current)...............................-1.2V to +1.2V
DINN_, DINP_, CC_, SYNC, LDO_EN...................-0.3V to +5.6V
CLK, CLK, MODE_ Voltage Range........... -0.3V to (V_CC + 0.3V)
THP Logic Output Voltage Range.........................-0.3V to +5.6V
V_GPA, V_GPB Output Voltage
Range........max[(V_{PP_} - 5.6V), (V_EE + 0.6V)] to (V_{PP_} + 0.3V)
V_GNA, V_GNB Output Voltage
Range.......(V_{NN_} - 0.3V) to min[(V_CC + 0.6V), (V_{NN_} + 5.6V)]
Continuous Power Dissipation (T_A = +70°C)
TQFN (derate 50mW/NC above +70°C).......................4000mW
Operating Temperature Range........................... -40°C to +85°C
Maximum Junction Temperature......................................+150°C
Storage Temperature Range............................. -65°C to +150°C
Lead Temperature (soldering, 10s).................................+300°C
Lead Temperature (reflow)...............................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TQFN
Junction-to-Ambient Thermal Resistance (B_JA).............20°C/W
Junction-to-Case Thermal Resistance (B_JC)...................0.5°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
DC ELECTRICAL CHARACTERISTICS
(V_DD = +3V, V_CC = +5V, V_EE = -5V, V_PPA = +100V, V_NNA = -100V, V_PPB = +100V, V_NNB = -100V, 1FF bypass capacitor between
VGNA and VNNA, 1FF bypass capacitor between VGNB and VNNB, 1FF bypass capacitor between VGPA and VPPA, 1FF bypass
capacitor between VGPB and VPPB, V_{LDO_EN} = 0V, no load, unless otherwise noted. Typical values are at T_A = +25°C.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
MIN TYP MAX UNITS
POWER SUPPLIES (V_DD, V_CC, V_EE, V_{PP_}, V_NN_)
Logic Supply Voltage
V_DD
Positive Drive Supply Voltage
V_CC
Negative Drive Supply Voltage
V_EE
High-Side Supply Voltage
V_{PP_}
Low-Side Supply Voltage
V_{NN_}
+1.7
+3 +5.25
V
+4.9
+5
+5.1
V
-5.1
-5
-4.9
V
0
+105
V
-105
0
V
External Low-Side LDO Voltage
V_{GN_} -
V_{NN_}
LDO_EN = high
5
5.3
5.5
V
External High-Side LDO Voltage
V_{PP_} -
V_{GP_}
LDO_EN = high
5
5.3
5.5
V
External Floating Power-Supply
Current from V_{GN_}
I_{VGN_} LDO_EN = high (Note 3)
50
mA
External Floating Power-Supply
Current from V_{GP_}
I_{VGP_} LDO_EN = high (Note 3)
85
mA
LOGIC INPUTS/OUTPUTS (DINN_, DINP_, MODE_, SYNC, CC_, LDO_EN)
Low-Level Input Threshold
V_IL
High-Level Input Threshold
V_IH
Logic Input Capacitance
C_IN
0.2 x V_DD
V
0.8 x V_DD
V
4
pF
Maxim Integrated
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