MAX14770E_13 Datasheet, PDF (2/16 Pages) Maxim Integrated Products – High-ESD Profibus RS-485 Transceiver

MAX14770E
High-ESD Profibus RS-485 Transceiver
ABSOLUTE MAXIMUM RATINGS
(Voltages referenced to GND.)
VCC........................................................................-0.3V to +6.0V
RE, RO........................................................-0.3V to (VCC + 0.3V)
DE, DI....................................................................-0.3V to +6.0V
A, B......................................................................-8.0V to +13.0V
Short-Circuit Duration (RO, A, B) to GND..................Continuous
Continuous Power Dissipation (TA = +70NC)
SO (derate 7.6mW/NC above +70NC)..........................606mW
TDFN (derate 24.4mW/NC above +70NC)..................1951mW
FMAX (derate 4.8mW/NC above +70NC)...................387.8mW
Operating Temperature Range
MAX14470EESA...............................................-40NC to +85NC
MAX14470EG_A.............................................. -40NC to +105NC
MAX14470EATA.............................................. -40NC to +125NC
Storage Temperature Range............................. -65NC to +150NC
Junction Temperature Range............................ -40NC to +150NC
Lead Temperature (soldering, 10s).................................+300NC
Soldering Temperature (reflow).......................................+260NC
PACKAGE THERMAL CHARACTERISTICS (Note 1)
SO
Junction-to-Ambient Thermal Resistance (qJA).........132°C/W
Junction-to-Case Thermal Resistance (qJC)...............38°C/W
µMAX
Junction-to-Ambient Thermal Resistance (qJA)......206.3°C/W
Junction-to-Case Thermal Resistance (qJC)...............42°C/W
TDFN
Junction-to-Ambient Thermal Resistance (qJA)...........41°C/W
Junction-to-Case Thermal Resistance (qJC).................8°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VCC = +5V Q10%, TA = TMIN to TMAX, unless otherwise noted. Typical values are at VCC = +5V, TA = +25NC.) (Note 2)
PARAMETER
Power-Supply Range
Supply Current
Shutdown Supply
Current
DRIVER
Differential Driver
Output
Differential Driver
Peak-to-Peak Output
SYMBOL
VCC
ICC
ISH
CONDITIONS
DE = 1, RE = 0 or
DE = 0, RE = 0 or
DE = 1, RE = 1; no load
DE = 0, RE = 1
|VOD|
VODPP
RL = 54I, DI = VCC or GND; Figure 1
Figure 2 (Note 3)
MIN TYP MAX
4.5
5.5
2.5
4
15
2.1
4.0
6.8
Change in Magnitude
of Differential Output
Voltage
DVOD
RL = 54I; Figure 1 (Note 4)
-0.2
0
+0.2
Driver Common-
Mode Output Voltage
Change in Common-
Mode Voltage
VOC
DVOC
RL = 54I; Figure 1
RL = 54I; Figure 1 (Note 4)
1.8
3
-0.2
+0.2
Driver Short-Circuit
Output Current
(Note 5)
IOSD
0V P VOUT P +12V; output low
-7V P VOUT P VCC; output high
-250
+250
UNITS
V
mA
FA
V
V
V
V
V
mA
2  
Maxim Integrated