MAX13325_12 Datasheet, PDF (2/21 Pages) Maxim Integrated Products – Dual Automotive, Audio Line Drivers with I2C Control and Diagnostic

MAX13325/MAX13326
Dual Automotive, Audio Line Drivers
with I²C Control and Diagnostic
ABSOLUTE MAXIMUM RATINGS
VDD to PGND.........................................................-0.3V to +28V
CHOLD ..................................................................-0.3V to +28V
VL to GND................................................................-0.3V to +6V
GND, PGND .........................................................-0.3V to +0.3V
OUT_ to PGND......................................................... -0.3V to 28V
IN_, BIAS to AGND...................................-0.3V to (VDD + 0.3V)
SCL, SDA, ADD0, ADD1, MUTE, SHDN,
FLAG to GND...........................................................-0.3V to +6V
OUT_ Short Circuit to PGND or VDD..........................Continuous
Short Circuits Between Any OUT_.............................Continuous
Continuous Power Dissipation (TA = +70NC) (multilayer board)
28-Pin TSSOP (derate 27mW/NC above +70NC)......2162.2mW
Operating Temperature Range......................... -40NC to +105NC
Storage Temperature Range............................. -65NC to +150NC
Junction Temperature......................................................+150NC
Lead Temperature (soldering, 10s).................................+300NC
Soldering Temperature (reflow).......................................+260NC
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
Junction-to-Ambient Thermal Resistance (q_JA)...........37°C/W
Junction-to-Case Thermal Resistance (q_JC)..................2°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
ELECTRICAL CHARACTERISTICS
(VDD = 14.4V, VL = 5V, RL = J, load impedance from OUT_+ to OUT_-, TA = TJ = -40NC to +105NC, typical values are TA = +25NC,
unless otherwise noted.) (Note 2)
PARAMETER
SYMBOL
AMPLIFIER DC CHARACTERISTICS
Transient Supply Voltage
(Load Dump)
VDDMAX
Operating Supply Voltage Range
VDD OVLO Threshold
VDD UVLO Threshold
VL UVLO Threshold
VDD
VL
VDDOV
VDDUV
VLUV
Supply Current
IDD
Logic Supply Current
IL
Shutdown Supply Current
ISHDN
Turn-On Time (from Shutdown)
Turn-On Time (from Mute)
Differential Input Resistance
Single-Ended Input Impedance
RINDIF
RIN
Signal-Path Gain (Note 3)
AV
CONDITIONS
Using external nMOS-RTR020N05, 300ms
duration
Rising edge
Falling edge
Falling edge
TA = +25NC, no load
TA = -40NC to +105NC, no load
VL = 5V
IDD
TA = +25NC
TA = -40NC to +105NC
IL
MUTE = VL
SHDN = VL, CCSS = 220nF
Measure across input
Each input to ground (MAX13325)
Each input to ground (MAX13326)
MAX13325
MAX13326
MIN
4.5
2.7
18.5
3.3
2.2
18
15
12
11.8
-0.2
TYP
19.2
3.5
2.4
39
1.7
0.5
0.5
< 0.1
220
6
24
20
16
12
0
MAX UNITS
50
V
18
V
5.5
V
V
V
mA
50
mA
mA
10
FA
2
FA
ms
ms
30
kI
25
kI
20
12.2
dB
+0.2
2  
Maxim Integrated