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MAX13256 Datasheet, PDF (2/17 Pages) Maxim Integrated Products – 36V H-Bridge Transformer Driver for Isolated Supplies Integrated System Protection
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MAX13256
36V H-Bridge Transformer
Driver for Isolated Supplies
ABSOLUTE MAXIMUM RATINGS
(Voltages referenced to GND.)
VDD, FAULT...........................................................-0.3V to +40V
ST1, ST2.................................................... -0.3V to (VDD + 0.3V)
CLK, ITH, EN............................................................-0.3V to +6V
FAULT Continuous Current.............................................. Q50mA
ST1, ST2 Continuous Current........................................ Q850mA
Continuous Power Dissipation (TA = +70NC)
TDFN (Four-Layer Board)
(derate 24.4mW/NC above +70NC)..........................1951.2mW
TDFN (Single-Layer Board)
(derate 18.5mW/NC above +70NC)..........................1481.5mW
Operating Temperature Range......................... -40NC to +125NC
Junction Temperature......................................................+150NC
Storage Temperature Range............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow).......................................+260NC
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TDFN (Four-Layer Board)
Junction-to-Ambient Thermal Resistance (BJA)...........41NC/W
Junction-to-Case Thermal Resistance (BJC)..................9NC/W
TDFN (Single-Layer Board)
Junction-to-Ambient Thermal Resistance (BJA)...........54NC/W
Junction-to-Case Thermal Resistance (BJC)..................9NC/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7. For detailed
information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
ELECTRICAL CHARACTERISTICS
(VDD = 8V to 36V, VEN = 0V, TA = -40NC to +125NC, unless otherwise noted. Typical values are at TA = +25NC.) (Note 2)
PARAMETER
DC CHARACTERISTICS
Supply Voltage Range
Supply Current
SYMBOL
CONDITIONS
VDD
(Note 3)
IDD
VEN = 0V, VCLK = 0V, RLIM = 1000I,
ST1/ST2 not connected
MIN TYP MAX
8
36
6
9
UNITS
V
mA
Disable Supply Current
IDIS
VEN = 3.3V, VCLK = 0V
Driver Output Resistance
Undervoltage-Lockout Threshold
Undervoltage-Lockout Threshold
Hysteresis
ROH
ROL
VUVLO
VUVLO_HYST
ST1 = ST2 = high, IST1, ST2 = +300mA,
RLIM = 1000I
ST1 = ST2 = low, IST1, ST2 = -300mA,
RLIM = 1000I
VDD rising
0.65 1.1
mA
1
1.5
I
0.6
1.0
5.9
6.3
6.9
V
300
mV
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