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| MAX13046E Datasheet, PDF (2/15 Pages) Maxim Integrated Products – Single- and Dual-Bidirectional Low-Level Translator | |||
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Single- and Dual-Bidirectional
Low-Level Translator
ABSOLUTE MAXIMUM RATINGS
(All voltages referenced to GND.)
VCC ...........................................................................-0.3V to +6V
VL..............................................................................-0.3V to +4V
I/O VCC .......................................................-0.3V to (VCC + 0.3V)
I/O VL ............................................................-0.3V to (VL + 0.3V)
SHDN........................................................................-0.3V to +6V
Short-Circuit Duration I/O VL, I/O VCC to GND...........Continuous
Power Dissipation (TA = +70°C)
6-Pin µDFN (derate 2.1mW/°C above +70°C) .............168mW
10-Pin UTQFN (derate 6.9mW/°C above +70°C).........559mW
Junction-to-Ambient Thermal Resistance (θJA) (Note 1)
6-Pin µDFN .................................................................477°C/W
10-Pin UTQFN ...........................................................20.1°C/W
Junction-to-Ambient Thermal Resistance (θJC) (Note 1)
6-Pin µDFN ................................................................20.1°C/W
10-Pin UTQFN .........................................................143.1°C/W
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
Stresses beyond those listed under âAbsolute Maximum Ratingsâ may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VCC = +1.65V to +5.5V, VL = +1.1V to minimum of either +3.6V or ((VCC + 0.3V)), I/O VL and I/O VCC are unconnected, TA = -40°C to
+85°C, unless otherwise noted. Typical values are VCC = +3.3V, VL = +1.8V at TA = +25°C.) (Notes 2, 3)
PARAMETER
POWER SUPPLY
VL Supply Range
VCC Supply Range
Supply Current from VCC
Supply Current from VL
VCC Shutdown-Mode Supply Current
SYMBOL
CONDITIONS
VL
VCC
IQVCC
IQVL
ISD-VCC
VCC > 3.3V
VCC ⤠3.3V
TA = +25°C, SHDN = GND
MIN TYP MAX UNITS
1.1
3.6V
V
1.1
VCC + 0.3V
1.65
5.5
V
10
µA
15
µA
0.03
1
µA
VL Shutdown-Mode Supply Current
ISD-VL TA = +25°C, SHDN = GND
0.03
1
µA
I/O VL and I/O VCC Shutdown-Mode
Leakage Current
SHDN Input Leakage
ESD PROTECTION
I/O VCC (Note 4)
All Other Pins
LOGIC-LEVEL THRESHOLDS
I/O VL Input-Voltage High
I/O VL Input-Voltage Low
ISD-LKG
TA = +25°C, SHDN = GND
TA = +25°C
Human Body Model
IEC 61000-4-2 Air-Gap Discharge
IEC 61000-4-2 Contact Discharge
Human Body Model
VIHL
VILL
0.02 0.5
µA
0.02 0.1
µA
±15V
±15V
kV
±8V
±2
kV
VL -
0.2
V
0.15
V
2 _______________________________________________________________________________________
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