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MAX11129_12 Datasheet, PDF (2/36 Pages) Maxim Integrated Products – 3Msps, Low-Power, Serial 12-/10-Bit,8-/16-Channel ADCs
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MAX11129–MAX11132
3Msps, Low-Power, Serial 12-/10-Bit,
8-/16-Channel ADCs
ABSOLUTE MAXIMUM RATINGS
VDD to GND..............................................................-0.3V to +4V
OVDD, AIN0–AIN13, CNVST/AIN14, REF+, REF-/AIN15
to GND.......................-0.3V to the lower of (VDD + 0.3V) and +4V
CS, SCLK, DIN, DOUT, EOC TO GND...... -0.3V to the Lower of
(VOVDD + 0.3V) and +4V
DGND to GND.......................................................-0.3V to +0.3V
Input/Output Current (all pins)............................................50mA
Continuous Power Dissipation (TA = +70NC)
TQFN (derate 34.4mW/NC above +70NC)..................2758mW
Operating Temperature Range......................... -40NC to +125NC
Junction Temperature......................................................+150NC
Storage Temperature Range............................. -65NC to +150NC
Lead Temperature (soldering, 10s).................................+300NC
Soldering Temperature (reflow).......................................+260NC
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TQFN
Junction-to-Ambient Thermal Resistance (BJA)............29NC/W
Junction-to-Case Thermal Resistance (BJC)...................2NC/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
ELECTRICAL CHARACTERISTICS (MAX11131/MAX11132)
(VDD = 2.35V to 3.6V, VOVDD = 1.5V to 3.6V, fSAMPLE = 3Msps, fSCLK = 48MHz, 50% duty cycle, VREF+ = VDD, TA = -40NC to +125NC,
unless otherwise noted. Typical values are at TA = +25NC.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
MIN
DC ACCURACY (Notes 3 and 4)
Resolution
RES 12 bit
12
Integral Nonlinearity
INL
Differential Nonlinearity
DNL No missing codes
Offset Error
Gain Error
(Note 5)
Offset Error Temperature
Coefficient
OETC
Gain Temperature Coefficient
Channel-to-Channel Offset
Matching
GETC
Line Rejection
PSR (Note 6)
DYNAMIC PERFORMANCE (500kHz, input sine wave) (Notes 3 and 7)
Signal-to-Noise Plus Distortion
SINAD
70
Signal-to-Noise Ratio
SNR
70
Total Harmonic Distortion
(Up to the 5th Harmonic)
THD
Spurious-Free Dynamic Range
SFDR
79
Intermodulation Distortion
IMD f1 = 398.4375kHz, f2 = 275.8125kHz
TYP
-0.1
+0.3
±2
±0.8
±0.5
±0.5
72.2
72.3
-88
90
-85
MAX
UNITS
±1.0
±1.0
±4.0
±4.0
±2
Bits
LSB
LSB
LSB
LSB
ppm/NC
ppm/NC
LSB
LSB/V
dB
dB
-78
dB
dB
dB
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