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| MAX1077 Datasheet, PDF (2/18 Pages) Maxim Integrated Products – 1.5Msps, Single-Supply, Low-Power, True-Differential, 10-Bit ADCs with Internal Reference | |||
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1.5Msps, Single-Supply, Low-Power, True-
Differential, 10-Bit ADCs with Internal Reference
ABSOLUTE MAXIMUM RATINGS
VDD to GND ..............................................................-0.3V to +6V
VL to GND ................-0.3V to the lower of (VDD + 0.3V) and +6V
Digital Inputs
to GND .................-0.3V to the lower of (VDD + 0.3V) and +6V
Digital Output
to GND ....................-0.3V to the lower of (VL + 0.3V) and +6V
Analog Inputs and
REF to GND..........-0.3V to the lower of (VDD + 0.3V) and +6V
RGND to GND .......................................................-0.3V to +0.3V
Maximum Current into Any Pin............................................50mA
Continuous Power Dissipation (TA = +70°C)
12-Pin TQFN (derate 16.9mW/°C above +70°C) ......1349mW
Operating Temperature Range
MAX107_ ETC.................................................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-60°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
Stresses beyond those listed under âAbsolute Maximum Ratingsâ may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VDD = +2.7V to +3.6V, VL = VDD, fSCLK = 24MHz, 50% duty cycle, TA = -40°C to +85°C, unless otherwise noted. Typical values are
at TA = +25°C.)
PARAMETER
DC ACCURACY
SYMBOL
CONDITIONS
MIN TYP MAX UNITS
Resolution
Relative Accuracy
Differential Nonlinearity
Offset Error
INL
DNL
(Note 1)
(Note 2)
10
Bits
-0.5
+0.5 LSB
-0.5
+0.5 LSB
±2
LSB
Offset-Error Temperature
Coefficient
±1
ppm/°C
Gain Error
Offset nulled
±2
LSB
Gain Temperature Coefficient
±2
ppm/°C
DYNAMIC SPECIFICATIONS (fIN = 525kHz sine wave, VIN = VREF, unless otherwise noted.)
Signal-to-Noise Plus Distortion
SINAD
60
61
dB
Total Harmonic Distortion
THD Up to the 5th harmonic
-80
-74
dB
Spurious-Free Dynamic Range
Intermodulation Distortion
Full-Power Bandwidth
Full-Linear Bandwidth
CONVERSION RATE
Minimum Conversion Time
Maximum Throughput Rate
Minimum Throughput Rate
Track-and-Hold Acquisition Time
Aperture Delay
SFDR
IMD
fIN1 = 250kHz, fIN2 = 300kHz
-3dB point, small-signal method
S/(N + D) > 56dB, single ended
tCONV (Note 3)
tACQ
(Note 4)
(Note 5)
-80
-74
dB
-78
dB
15
MHz
1.2
MHz
0.667
µs
1.5
Msps
10
ksps
125
ns
5
ns
Aperture Jitter
External Clock Frequency
fSCLK
(Note 6)
(Note 7)
30
ps
24
MHz
2 _______________________________________________________________________________________
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