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MAX1198 Datasheet, PDF (18/22 Pages) Maxim Integrated Products – Dual, 8-Bit, 100Msps, 3.3V, Low-Power ADC with Internal Reference and Parallel Outputs
Dual, 8-Bit, 100Msps, 3.3V, Low-Power ADC
with Internal Reference and Parallel Outputs
3.3V
0.1µF
1
MAX6066
2 21.5kΩ
3
1µF
3.3V
0.1µF
MAX4254 POWER-SUPPLY
BYPASSING. PLACE CAPACITOR
AS CLOSE AS POSSIBLE TO
THE OP AMP.
2.0V
3
2
21.5kΩ
1.5V
5
6
21.5kΩ
1.0V
10
21.5kΩ
9
21.5kΩ
3.3V
4
1/4 MAX4252
1
2.0V AT 8mA
47Ω
11
10µF
330µF
6V
6V
1.47kΩ
3.3V
4
1/4 MAX4252
7
1.5V AT 0mA
47Ω
11
10µF
6V
330µF
6V
1.47kΩ
3.3V
4
1/4 MAX4252
8
1.0V AT -8mA
47Ω
11
10µF
6V
330µF
6V
1.47kΩ
NOTE: ONE FRONT-END REFERENCE CIRCUIT DESIGN MAY BE USED WITH UP TO 32 ADCs.
N.C.
29 REFOUT
31 REFIN
32 REFP
1 REFN
N=1
MAX1198
2 COM
0.1µF 0.1µF 0.1µF
0.1µF
2.2µF
10V
N.C.
29 REFOUT
31 REFIN
32
REFP
N = 32
1 REFN
2 COM
MAX1198
0.1µF 0.1µF 0.1µF
Figure 9. External Unbuffered Reference Drive with MAX4252 and MAX6066
shifted with respect to the in-phase component. At the
receiver, the QAM signal is divided down into its I and
Q components, essentially representing the modulation
process reversed. Figure 10 displays the demodulation
process performed in the analog domain, using the
dual matched 3.3V, 8-bit ADC MAX1198 and the
MAX2451 quadrature demodulator to recover and
digitize the I and Q baseband signals. Before being
digitized by the MAX1198, the mixed down-signal com-
ponents may be filtered by matched analog filters, such
as Nyquist or pulse-shaping filters, which remove
unwanted images from the mixing process, thereby
enhancing the overall signal-to-noise (SNR) perfor-
mance and minimizing intersymbol interference.
Grounding, Bypassing,
and Board Layout
The MAX1198 requires high-speed board layout design
techniques. Locate all bypass capacitors as close to
the device as possible, preferably on the same side as
the ADC, using surface-mount devices for minimum
inductance. Bypass VDD, REFP, REFN, and COM with
two parallel 0.1µF ceramic capacitors and a 2.2µF
bipolar capacitor to GND. Follow the same rules to
bypass the digital supply (OVDD) to OGND. Multilayer
boards with separated ground and power planes
produce the highest level of signal integrity. Consider
the use of a split ground plane arranged to match the
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