DS1337_09 Datasheet, PDF (15/16 Pages) Maxim Integrated Products – I2C Serial Real-Time Clock

DS1337 I²C Serial Real-Time Clock
HANDLING, PC BOARD LAYOUT, AND ASSEMBLY
The DS1337C package contains a quartz tuning-fork crystal. Pick-and-place equipment may be used, but
precautions should be taken to ensure that excessive shocks are avoided. Ultrasonic cleaning should be avoided
to prevent damage to the crystal.
Avoid running signal traces under the package, unless a ground plane is placed between the package and the
signal line. All N.C. (no connect) pins must be connected to ground.
Moisture-sensitive packages are shipped from the factory dry-packed. Handling instructions listed on the package
label must be followed to prevent damage during reflow. Refer to the IPC/JEDEC J-STD-020 standard for
moisture-sensitive device (MSD) classifications.
PIN CONFIGURATIONS
TOP VIEW
X1
X2
INTA
GND
DS1337
V_CC
SQW/INTB
SCL
SDA
DIP
X1
X2
INTA
GND
DS1337
V_CC
SQW/INTB
SCL
SDA
SO, SOP
SCL
SQW/INTB
V_CC
N.C.
N.C.
N.C.
N.C.
N.C.
DS1337C
SDA
GND
INTA
N.C.
N.C.
N.C.
N.C.
N.C.
SO (300 mils)
CHIP INFORMATION
TRANSISTOR COUNT: 10,950
PROCESS: CMOS
THERMAL INFORMATION
PACKAGE
8 DIP
8 SO
8 μSOP
16 SO
THETA-J_A
(°C/W)
110
170
229
73
THETA-J_C
(°C/W)
40
40
39
23
PACKAGE INFORMATION
For the latest package outline information and land patterns, go to www.maxim-ic.com/packages.
PACKAGE TYPE PACKAGE CODE DOCUMENT NO.
8 PDIP
P8+8
21-0043
8 SO
S8+2
21-0041
8 MAX
U8+1
21-0036
16 SO
W16-H2
21-0042
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