DS1643 Datasheet, PDF (14/17 Pages) Dallas Semiconductor – Nonvolatile Timekeeping RAM

DS1643P
DS1643/DS1643P
PKG
DIM
A
B
C
D
E
F
G
MIN
0.920
0.980
-
0.052
0.048
0.015
0.025
INCHES
NOM
0.925
0.985
-
0.055
0.050
0.020
0.027
MAX
0.930
0.990
0.080
0.058
0.052
0.025
0.030
NOTE: MAXIM RECOMMENDS THAT POWERCAP MODULE
BASES EXPERIENCE ONE PASS THROUGH SOLDER
REFLOW ORIENTED WITH THE LABEL SIDE UP (“LIVE-
BUG”).
HAND SOLDERING AND TOUCH-UP: DO NOT TOUCH OR
APPLY THE SOLDERING IRON TO LEADS FOR MORE THAN
3 SECONDS.
TO SOLDER, APPLY FLUX TO THE PAD, HEAT THE LEAD
FRAME PAD AND APPLY SOLDER. TO REMOVE THE PART,
APPLY FLUX, HEAT THE LEAD FRAME PAD UNTIL THE
SOLDER REFLOWS AND USE A SOLDER WICK TO
REMOVE SOLDER.
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