DS1318 Datasheet, PDF (14/15 Pages) Dallas Semiconductor – Parallel-Interface Elapsed Time Counter

Parallel-Interface Elapsed Time Counter
Chip Information
PROCESS: CMOS
SUBSTRATE CONNECTED TO GROUND
Package Information
For the latest package outline information and land patterns,
go to www.maxim-ic.com/packages. Note that a “+”, “#”, or
“-” in the package code indicates RoHS status only. Package
drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
PACKAGE
TYPE
24 TSSOP
PACKAGE
CODE
U24+2
OUTLINE
LAND
NO. PATTERN NO.
21-0066
90-0118
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