MAX3394E Datasheet, PDF (1/20 Pages) Maxim Integrated Products – ±15kV ESD-Protected, High-Drive Current, Dual-/Quad-/ Octal-Level Translators with Speed-Up Circuitry

19-3884; Rev 2; 2/07
±15kV ESD-Protected, High-Drive Current, Dual-/Quad-/
Octal-Level Translators with Speed-Up Circuitry
General Description
The MAX3394E/MAX3395E/MAX3396E bidirectional
level translators provide level shifting required for data
transfer in a multivoltage system. Internal slew-rate
enhancement circuitry features 10mA current-sink and
15mA current-source drivers to isolate capacitive loads
from lower current drivers. In open-drain systems, slew-
rate enhancement enables fast data rates with larger
pullup resistors and increased bus load capacitance.
Externally applied voltages, V_CC and V_L, set the logic-
high levels for the device. A logic-low signal on one I/O
side of the device appears as a logic-low signal on the
opposite I/O side, and vice-versa. Each I/O line is
pulled up to V_CC or V_L by an internal pullup resistor,
allowing the devices to be driven by either push-pull or
open-drain drivers.
The MAX3394E/MAX3395E/MAX3396E feature a tri-
state output mode, thermal-shutdown protection, and
±15kV Human Body Model (HBM) ESD protection on
the V_CC side for greater protection in applications that
route signals externally.
The MAX3394E/MAX3395E/MAX3396E accept V_CC volt-
ages from +1.65V to +5.5V, and V_L voltages from +1.2V
to V_CC, making them ideal for data transfer between low
voltage ASIC/PLDs and higher voltage systems. The
MAX3394E/MAX3395E/MAX3396E operate at a guaran-
teed data rate of 6Mbps with push-pull drivers and
1Mbps with open-drain drivers.
The MAX3394E is a dual-level translator available in
9-bump UCSP™ and 8-pin 3mm x 3mm TDFN packages.
The MAX3395E is a quad-level translator available in 12-
bump UCSP, and 12-pin 4mm x 4mm TQFN packages.
The MAX3396E is an octal-level translator available in 20-
bump UCSP and 20-pin 5mm x 5mm TQFN packages.
The MAX3394E/MAX3395E/MAX3396E operate over the
extended -40°C to +85°C temperature range.
Applications
Multivoltage Bidirectional Level Translation
SPI™, MICROWIRE™, and I²C Level Translation
Open-Drain Rise-Time Speed-Up
High-Speed Bus Fan-Out Expansion
Cell Phones
Telecom, Networking, Servers, RAID/SAN
Features
♦ ±15kV ESD Protection on I/O V_{CC_} Lines
♦ Bidirectional Level Translation Without Direction
Pin
♦ I/O V_{L_} and I/O V_{CC_} 10mA Sink-/15mA Source-
Current Capability
♦ Slew-Rate Enhancement Circuitry Supports
Larger Capacitive Loads or Larger External Pullup
Resistors
♦ 6Mbps Push-Pull/1Mbps Open-Drain Guaranteed
Data Rate
♦ Wide Supply-Voltage Range: Operation Down to
+1.2V on V_L and +1.65V on V_CC
♦ Low Supply Current in Tri-State Output Mode
(3µA typ)
♦ Low Quiescent Current
♦ Thermal-Shutdown Protection
♦ UCSP, TDFN, and TQFN Packages
Ordering Information
PART
PIN-PACKAGE
PKG CODE
MAX3394EETA+T
8 TDFN-EP**
T833-1
MAX3394EEBL+T
9 UCSP
B9-5
MAX3395EETC+
12 TQFN-EP**
T1244-4
MAX3395EEBC+T
12 UCSP
B12-1
MAX3396EEBP+T*
20 UCSP
B20-1
MAX3396EETP+*
20 TQFN-EP**
T2055-4
Note: All devices specified over the -40°C to +85°C operating
range.
+Denotes lead(Pb)-free/RoHS-compliant package.
*Future product—contact factory for availability.
**EP = Exposed paddle.
Selector Guide appears at end of data sheet.
Pin Configurations
TOP VIEW
(LEADS ON BOTTOM)
8765
*EP
MAX3394E
+
1234
MICROWIRE is a trademark of National Semiconductor Corp.
SPI is a trademark of Motorola, Inc.
UCSP is a trademark of Maxim Integrated Products, Inc.
TDFN
*CONNECT EXPOSED PAD TO GROUND
Pin Configurations continued at end of data sheet.
________________________________________________________________ Maxim Integrated Products 1
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