MA03501D Datasheet, PDF (7/7 Pages) Tyco Electronics – X-Band Gain/Phase Control MMIC 8.0 -11.0 GHz

X-Band Serial Input Gain/Phase Control MMIC
Assembly and Bonding Diagram
V_GG
0.1 µF
100 pF
RO-P-DS-3004 - - 7/7
MA03501D
100 pF
0.1 µF
V_DD
RF_IN
RF_OUT
100 pF
3 _DATA
V_EE
0.1 µF
Figure 5. Recommended bonding diagram.
Support circuitry typical of MMIC characterization fixture for CW testing.
Assembly Instructions:
Die attach: Use AuSn (80/20) 1-2 mil. preform solder. Limit time @ 300 °C to less than 5 minutes.
Wirebonding: Bond @ 160 °C using standard ball or thermal compression wedge bond techniques. For
DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of
shortest length, although ball bonds are also acceptable.
Biasing Note: Must apply negative bias to V_GG before applying positive bias to V_DD to prevent
damage to amplifier.
Specifications subject to change without notice.
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