MA4SW110 Datasheet, PDF (6/8 Pages) Tyco Electronics – Monolithic PIN Diode Switches

Monolithic Pin Diode Switches
Wire Bonding
Top contact is 2.5 µM thick gold. Yellow areas in chip,
outline drawings below indicate bonding
pads.Thermosonic wedge bonding using 0.003” x
0.00025” ribbon or 0.001” diameter gold wire is
recommended. A heatstage temperature of 150 ^oC and a
force of 18 to 22 grams should be used. Ultrasonic energy
should be adjusted to the minimum required to achieve a
good bond. RF bonds should be kept as short as
possible.
Mounting
These chips have TiPtAu back metal. Gold thickness is
1.0 µM. They can be die mounted with a gold-tin eutectic
solder preform or conductive epoxy. Mounting surface
must be clean and flat.
MA4SW110, MA4SW210, MA4SW310
V5.00
Eutectic Die Attachment
An 80/20 gold-tin eutectic solder preform is recommended
with a work surface temperature of 255 ^oC and a tool tip
temperature of 265^oC. When hot gas is applied, the tool tip
temperature should be 290 ^oC. The chip should not be
exposed to temperatures greater than 320 ^oC for more than
20 seconds. No more than three seconds should be required
for attachment.
Epoxy Die Attachment
Assembly should be preheated to 125 -150 ^oC. A minimum
amount of epoxy should be used. A thin epoxy fillet should
be visible around the perimeter of the chip after placement.
Cure epoxy per manufacturer’s schedule.
Chip Outline Drawing
MA4SW110
DIM
INCHES
MIN.
MAX.
A
0.014
0.018
B
0.025
0.029
C
0.008 REF
D
0.004
0.006
E
0.004 REF
F
0.003 REF
G
0.003 REF
H
0.020 REF
MM
MIN.
MAX.
0.35
0.45
0.64
0.74
0.20 REF
0.10
0.15
0.10 REF
0.08 REF
0.08 REF
0.52 REF
Specification Subject to Change Without Notice
6
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