MRF177 Datasheet, PDF (5/9 Pages) Motorola, Inc – N-CHANNEL BROADBAND RF POWER MOSFET

RF
INPUT
C1
R1
+
C13
T1
VDD = 28 V
+
D1
R3
R2
C14 ⁺
+
C15
C16
T2
C2
C4
C3
R4
C5
MS1
C7
MS2
C6
R5
MRF177
L1
FERRITE BEAD C17
FERRITE BEAD
FERRITE BEAD
L2
T3
MS3
C8
MS4
D.U.T.
C10
C9
C11
+ _C18
T4
RF
OUTPUT
C12
MICROSTRIP DETAIL
0.15″
0.325″
0.10″
0.325″
0.10″
0.15″
0.45″
MS1
MS3
0.45″
0.45″
0.15″
MS2
MS4
0.10″
0.10″
0.45″
0.15″
0.325″
0.325″
C1, C12
C2, C3, C5, C6, C10, C11
C4, C9
C7
C8
C13, C14
C15, C18
C16
C17
1–10 pF JOHANSON OR EQUIVALENT D1
270 pF ATC 100 MIL CHIP CAP
L1
1–20 pF
L2
36 pF CHIP CAP
R1, R4, R5
10 pF CHIP CAP
R2
0.1 µFD @ 50 Vdc
R3
10 µFD @ 50 Vdc
T1
500 pF BUTTON
T2
1000 pF UNCASED MICA
T3
T4
BOARD
1N5347B, 20 Vdc
1–TURN NO. 18, 0.25″, 2–HOLE FERRITE BEAD
8–1/2 TURNS NO. 18, CLOSE WOUND .375″ DIA.
10 kΩ @ 1/2 W RESISTOR
10 kΩ, 10 TURN RESISTOR
2.0 kΩ @ 1/2 W RESISTOR
1–1/2 T, 50 Ω COAX, .034″ DIA. ON DUAL 0.5″ FERRITE CORE
2.0″ 25 Ω COAX, .075″ DIA.
2.1″ 10 Ω COAX, .075″ DIA.
4.0″ 50 Ω COAX, .0865″ DIA.
Dielectric Thickness = 0.060″ 2oz Copper, Cu–Clad, Teflon Fiberglass, ε_r = 2.55
Figure 8. Test Circuit Electrical Schematic
REV 9
5