MA02303GJ Datasheet, PDF (5/7 Pages) Tyco Electronics – RF Power Amplifier IC for 2.4 GHz ISM

RF Power Amplifier IC for 2.4 GHz ISM
Mechanical Data
MA02303GJ
Figure 11 Component layout and printed circuit drawing for evaluation board (60 mil GETEK
board).
Application Information
+V_DD
C3
C2
T7
RF_IN
T1
C1
T2
L1
R1
1
T3
2
3
T4
4
C4
3
T8
8
7
6
5
L2
T5
C5
RF_OUT
T6
C6
Figure 12 Evaluation Board Schematic
Full-Downset Paddle
To Board Ground
List of Components
Discrete Components
C1 – C4 = 100 pF multilayer ceramic chip capacitor
(Dielectric Labs C11AH101K5TXL)
C5 = 2.0 pF multilayer ceramic chip capacitor
(Dielectric Labs C11AH2R0BTXL)
C6 = 1.2 pF multilayer ceramic chip capacitor
(Dielectric Labs C11AH1R2B5TXL)
R1 = 300 Ω chip resistor (P300ECT-ND)
L1 = 1.8 nH chip inductor (Toko TKS235CT-ND)
L2 = 27 nH chip inductor (Coilcraft 1008CS-270XKBB)
Transmission Line Lengths*
T1 = 0.15"
T2 = 0.21"
T3 = 0.11" (Not very critical)
T4 = 0.16"
T5 = 0.13"
T6 = 0.16"
T7 = 0.13" (Not very critical)
T8 = 0.077" (Not very critical)
T1, T2, T3, T5, T6 are 0.077" wide
T4, T7, and T8 are 0.026" wide
*The board material is 0.060" FR-4 (distance is between RF and GND) with a dielectric constant of
about 4.3 (standard FR-4)
Specifications subject to change without notice.
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