MA4E1317 Datasheet, PDF (3/5 Pages) Tyco Electronics – GaAs Flip Chip Schottky Barrier Diodes

GaAs Flip Chip
Schottky Barrier Diodes
Mounting Techniques
These chips were designed to be inserted onto hard
or soft substrates with the junction side down. They
can be mounted with conductive epoxy or with a low
temperature solder preform. The die can also be
assembled with the junction side up, and wire or
ribbon bonds made to the pads.
Solder Die Attach: Solders with < 30% Sn by volume
or weight are recommended. 80 Au / 20 Sn and
Indalloy #2 solders are recommended. Do not
expose die to a temperature greater than 235°C, or
greater than 200°C for longer than 10 seconds. No
more than three seconds of scrubbing should be
required for attachment.
Conductive epoxy Die Attach: Assembly can be
preheated to 125 - 150°C. Use a controlled amount
of epoxy approximately 2 mils thick. Cure epoxy as
per manufacturer’s schedule. For extended cure
times, temperatures should be kept below 200°C.
MA4E1317, MA4E1318,
MA4E1319-1, MA4E1319-2 V1
Handling
The following precautions should be observed to
avoid damaging these chips:
Cleanliness: These chips should be handled in a
clean environment. Do not attempt to clean die after
installation.
Static Sensitivity: Schottky barrier diodes are ESD
sensitive and can be damaged by static electricity.
Proper ESD techniques should be used when
handling these devices.
General Handling: The protective polymer coating
on the active areas of these die provides scratch
protection, particularly for the metal airbridge which
contacts the anode. Die can be handled with
tweezers or vacuum pickups and are suitable for use
with automatic pick-and-place equipment.
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