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108-5246 Datasheet, PDF (10/21 Pages) Tyco Electronics – This specification covers the requirements for product performance | |||
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Product Specification
108-5246
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Para.
Test Items
Requirements
Procedures
3.5.20 ã¯ãã èç±æ§
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温度360â±10âæéï¼+1-0
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3.5.20
Resistance to Soldering
Heat
Appearance of the specimen
shall be inspected after the
test with the assistance of a
magnifier capable of giving a
magnification of 10 X for
damage such as cracks, ships
or melting.
Aftre mounting post header
assembly and receptacle header
assembly mounted on PCB, expose
the samples under the soldering
heat of the following conditions.
The specified temperature is
measured at the surface of PCB.
<DIP TYPE>
Immersing the soldering tine areas
into soldering tub at 260±5°C for
10±1 seconds.
<SMT TYPE>
Reflow cycles: 2 times
Temperature profile:as shown in
Fig.10.
<Manual test>
Expose under the head of the top of
iron at 360±10â for 3+1-0 seconds.
To be no damage by the top of iron
etc.at soldering tynes.
注ãç®è¦æ¤æ»ã®å¿
è¦æ¡ä»¶ã«åè´ããç©ççæå·ããªããä¸ã¤ Fig.3 ã®ã·ã¼ã¯ã¨ã³ã¹è©¦é¨ã«è¦å®ãããä»å ç試
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Note: Tested products shall be conforming to the requirements of the visual inspection without physical
damage, also meeting the requirements of the additional tests specified in the sequence tests specified
in Fig.3
Fig.2ï¼çµãï¼
Fig.2 (End)
Rev. L
10 of 21
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