XB1004-BD Datasheet, PDF (8/12 Pages) Mimix Broadband – 16.0-30.0 GHz GaAs MMIC Buffer Amplifier

XB1004-BD
Buffer Amplifier
16.0-30.0 GHz
Mechanical Drawing
1.500
(0.059)
0.798
1
(0.031)
1.290
(0.051)
2
1.892
(0.074)
3
4
0.798
(0.031)
Rev. V1
0.0
0.0
10 9 8 7 6 5
0.958
1.359
1.760
(0.038) (0.054) (0.069)
2.330
1.158
1.560
1.958 ^(0.092)
(0.046) (0.061) (0.077)
(Note: Engineering designator is 22LN3UA0279)
Units:millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness:0.110 +/- 0.010 (0.0043 +/- 0.0004),Backside is ground,Bond Pad/Backside Metallization:Gold
All Bond Pads are 0.100 x 0.100 (0.004 x 0.004).
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance:+/- 0.005 (+/- 0.0002).Approximate weight:2.165 mg.
Bond Pad #1 (RFIn)
Bond Pad #2 (Vd1)
Bond Pad #3 (Vd2)
Bond Pad #4 (RFOut)
Bias Arrangement
Bond Pad #5 (Vg2c)
Bond Pad #6 (Vg2b)
Bond Pad #7 (Vg2a)
Bond Pad #8 (Vg1c)
Bond Pad #9 (Vg1b)
Bond Pad #10 (Vg1a)
Vd 1,2
Bypass Capacitors - See App Note [2]
Vd1,2
2
3
RF In 1
4 RF Out
RF In
XB1004-BD
RF Out
10 9 8 7 6 5
Vg 1,2
Vg1c, Vg2c
8
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