MA4SWX10 Datasheet, PDF (8/9 Pages) M/A-COM Technology Solutions, Inc. – Specified from 50 MHz to 20 GHz

MA4SWx10 Series
HMIC™ Silicon PIN Diode Switches
Rev. V11
Cleanliness
The chips should be handled in a clean environment
free of dust and organic contamination.
Wire / Ribbon Bonding
Thermo compression wedge bonding using 0.003” x
0.00025” ribbon or 0.001” diameter gold wire is
recommended. A work stage temperature of
150°C - 200°C, tool tip temperature of 120°C - 150°
and a downward force of 18 to 22 grams should be
used. If ultrasonic energy is necessary, it should be
adjusted to the minimum level required to achieve a
good bond. Excessive power or force will fracture
the silicon beneath the bond pad causing it to lift.
RF bond wires and ribbons should be kept as short
as possible for optimum RF performance.
Chip Mounting
HMIC switches have Ti-Pt-Au backside metallization
and can be mounted using a gold-tin eutectic solder
or conductive epoxy. Mounting surface must be free
of contamination and flat.
Eutectic Die Attachment
80/20, gold-tin, solder is recommended. A re-flow
oven or hot gas die bonder with a temperature
setting of 290°C is normally used to melt the solder.
The chip should not be exposed to temperatures
greater than 320°C for more than 20 seconds.
Typically no more than three seconds at peak
temperature is required for attachment. RoHS
compliant solders may also be used but solders rich
in tin should be avoided as they will scavenge the
backside gold and/or cause gold embrittlement.
Epoxy Die Attachment
A minimum amount of epoxy, 1 - 2 mils thick, should
be used to attach chip. A thin epoxy fillet should be
visible around the outer perimeter of the chip after
placement. Epoxy cure time is typically 1 hour at
150°C.
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