M02014 Datasheet, PDF (8/19 Pages) M/A-COM Technology Solutions, Inc. – CMOS Transimpedance Amplifier with AGC for Fiber Optic Networks up to 2.5 Gbps

2.0 Pin Definitions
Table 2-1. Pad Description
Die Pad No
Name
Function
1
AGC
Monitor or force AGC voltage
2
V_CC
Power pin. Connect to most positive supply. (only one V_CC pad needs to be connected)
3
PINK
Common PIN input. Connect a 470 pF capacitor to Gnd when using this pad to bias the photodiode cathode ⁽¹⁾
4
PINA
Active PIN input. Connect to photo diode anode
5
V_CC
Power pin. Connect to most positive supply (only one V_CC pad needs to be connected)
6
MON
Analog current source output. Current matched to average photodiode current.
Intended for photo-alignment use only
7
DOUT
Differential data output (goes low as light increases)
8
DOUTGND Ground return for DOUT pad ⁽²⁾
9
GND
Ground pin. Connect to the most negative supply ⁽²⁾
10
GND
Ground pin. Connect to the most negative supply ⁽²⁾
11
DOUTGND Ground return for DOUT pad ⁽²⁾
12
DOUT
Differential data output (goes high as light increases)
NA
Backside Backside. Connect to the lowest potential, usually ground
NOTES:
1. Alternatively the photodiode cathode may be connected to a decoupled positive supply, e.g. V_CC.
2. All ground pads are common on the die. Only one ground pad needs to be connected to the TO-Can ground. However, connecting more than one
ground pad to the TO-Can ground, particularly those across the die from each other can improve performance in noisy environments.
Figure 2-1. Bare Die Layout
2
V_CC
3 _PINK
1
12
11
AGC DOUT DOUTGND
10
GND
4 PINA
V_CC
5
GND
MON DOUT DOUTGND
9
6
7
8
02014-DSH-001-D
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