MA4SW410 Datasheet, PDF (7/7 Pages) Tyco Electronics – SP4T Monolithic PIN Diode Switch

MA4SW410
HMIC™ Silicon SP4T PIN Diode Switch
RoHS Compliant
V6
ASSEMBLY INSTRUCTIONS
Cleanliness: The chips should be handled in a clean environment free of dust and organic contamination.
Electro-Static Sensitivity: The MA4SW410 PIN diode switch is ESD sensitive and proper precautions should be
taken to avoid damaging the chip. ESD rating is Class 0 (HBM) and Class C1 (CDM).
Wire / Ribbon Bonding: Thermosonic wedge bonding using 0.003” x 0.00025” ribbon or 0.001” diameter gold
wire is recommended. A work stage temperature of 150^oC – 200^oC, tool tip temperature of 120^oC –150^oC and a
downward force of 18 to 22 grams should be used. If ultrasonic energy is necessary, it should be adjusted to the
minimum level required to achieve a good bond. Excessive power or force will fracture the silicon beneath the
bond pad causing it to lift. RF bond wires and ribbons should be kept as short as possible for optimum RF
performance.
Chip Mounting: HMIC switches have Ti-Pt-Au backside metallization and can be mounted using a gold-tin
eutectic solder or conductive epoxy. Mounting surface must be free of contamination and flat.
Eutectic Die Attachment: 80/20, gold-tin, solder is recommended. A re-flow oven or hot gas die bonder with a
temperature setting of 290^oC is normally used to melt the solder. The chip should not be exposed to temperatures
greater than 320^oC for more than 20 seconds. Typically no more than three seconds at peak temperature is
required for attachment. RoHS compliant solders may also be used but solders rich in tin should be avoided as
they will scavenge the backside gold and/or cause gold embrittlement.
Epoxy Die Attachment: A minimum amount of epoxy, 1–2 mils thick, should be used to attach chip. A thin epoxy
fillet should be visible around the outer perimeter of the chip after placement. Epoxy cure time is typically 1 hour
at 150°C.
ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for
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development. Performance is based on target specifications, simulated results, and/or prototype
measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under develop-
ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has
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Visit www.macom.com for additional data sheets and product information.
been fixed. Engineering samples and/or test data may be available. Commitment to produce in
volume is not guaranteed.
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or
information contained herein without notice.